News Article
Replisaurus to collaborate with IMEC on 3D integration research
A joint development programme will employ S.E.T.'s high accuracy FC300 system to explore advanced 3D applications.
S.E.T. Smart Equipment Technology, a wholly-owned subsidiary of Replisaurus Technologies and a supplier of high accuracy die to die (D2D), die to wafer (D2W) bonding and nano-imprint lithography solutions, announced that they will collaborate with IMEC, an independent nano-electronics research institute, on the development of die pick and place and bonding processes for 3D chip integration, using S.E.T.'s Flip Chip bonder equipment.
IMEC’s 3D integration programme explores 3D technology and design for applications in various domains, focusing on 3D wafer-level packaging and 3D stacked ICs to find innovative solutions for the cost effective use of 3D interconnects.
The joint development programme will employ S.E.T.'s FC300, which is a high accuracy (≤0.5 µm), high force (4,000N) device bonder system for die to die and die to wafer bonding on wafers up to 300mm. The programme is scheduled to begin during the first quarter of 2009, at which time S.E.T. will enter the IMEC’s Industrial Affiliation Programme (IIAP) on 3D integration. The parties will collaborate to develop highly accurate pick and place processes and low temperature bonding processes, which are required by advanced 3D integration schemes.
"The integration of the FC300 will be a welcome addition to our 3D programme, as is the participation of S.E.T. and Replisaurus," said Luc van den Hove, Executive Vice President and COO of IMEC. "The Replisaurus and S.E.T. technologies are very interesting for advanced packaging applications, and the integration of this tool in particular will help complete our programme."
"IMEC's installation of the FC300 is fully in line with Replisaurus' product and technology portfolio, which offers game changing opportunities to the global chip market," said James Quinn, CEO of Replisaurus. "IMEC's advanced 3D integration program is recognised worldwide, and the FC300 is extremely complimentary to Replisaurus' ElectroChemical Pattern Replication (ECPR) technology, which is well suited for advanced 3D integration and related applications."
IMEC’s 3D integration programme explores 3D technology and design for applications in various domains, focusing on 3D wafer-level packaging and 3D stacked ICs to find innovative solutions for the cost effective use of 3D interconnects.
The joint development programme will employ S.E.T.'s FC300, which is a high accuracy (≤0.5 µm), high force (4,000N) device bonder system for die to die and die to wafer bonding on wafers up to 300mm. The programme is scheduled to begin during the first quarter of 2009, at which time S.E.T. will enter the IMEC’s Industrial Affiliation Programme (IIAP) on 3D integration. The parties will collaborate to develop highly accurate pick and place processes and low temperature bonding processes, which are required by advanced 3D integration schemes.
"The integration of the FC300 will be a welcome addition to our 3D programme, as is the participation of S.E.T. and Replisaurus," said Luc van den Hove, Executive Vice President and COO of IMEC. "The Replisaurus and S.E.T. technologies are very interesting for advanced packaging applications, and the integration of this tool in particular will help complete our programme."
"IMEC's installation of the FC300 is fully in line with Replisaurus' product and technology portfolio, which offers game changing opportunities to the global chip market," said James Quinn, CEO of Replisaurus. "IMEC's advanced 3D integration program is recognised worldwide, and the FC300 is extremely complimentary to Replisaurus' ElectroChemical Pattern Replication (ECPR) technology, which is well suited for advanced 3D integration and related applications."
