Info
Info
News Article

Fab Construction Metrics Dip

News
2009 spending on Fab construction products expected to reach lowest level since 1999
According to the World Fab Forecast report recently released by SEMI, 2009 spending on worldwide fabs equipping front-end facilities is expected to hit the lowest levels since 1994.



All regions are showing double-digit declines in construction spending in 2009, with the possible exception of the Americas. The Americas have experienced some of the lowest spending levels in the past few years, but are expected to see growth driven by Intel and AMD. Worldwide, eight facilities are expected to commence operations in 2009, and in 2010, a total of about 18 additional facilities may begin operations.



Since the global economic downturn, the hardest hit area in semiconductor manufacturing has been the memory industry, which has experienced bankruptcies and consolidations. A prime example of this is Qimonda, which filed for insolvency in January 2009, and subsequently closed down its manufacturing in the US, and dramatically cut capacity by 75 percent in its Front End fab in Dresden for the first quarter of 2009.



New growth will take time in the memory segment, which has dominated spending levels and capacity growth in the industry since 2001; however, plans by Intel and AMD are continuing investments in advanced technology.



Recently, both companies have announced multi-billion dollar plans for upgrades and capacity expansion both in the US and internationally. These investments also represent the largest investment in the US since 2007, when Intel launched Fab 32 and IM Flash established the Lehi and Manassas fabs.


Efinix’s Trion FPGA Silicon Platform Expands Into Europe
The AP&S Demo Center Will Help You. Request Your Wet Process Demonstration And Be Part Of It Live Via Video Chat.
Intel Shines Amidst The Carnage Of The 2019 Semiconductor Market
Semiconductor Memory Adoption To Be Augmented By Penetration Of Smartphones Across The Globe
Semiconductor Memory Market Worth Over USD 250 Bn By 2026
A Burgeoning Secondary SME Market Is Inevitable
High-end Inertial Sensors: At The Dawn Of A Mass-adoption?
ACM Research Launches Stress-Free Polishing Tool For Advanced Packaging Applications; Delivers First Tool To Leading Chinese OSAT
Picosun Reinforces Local Operations During The COVID-19 Epidemic
50th Hollow Cathode Gas Plasma Source Ordered From Meaglow
Critical Manufacturing Recognized By Gartner
Semiconductor Manufacturing: Achieving Water Authority Compliance
Security Lithography Advances To Thwart IC Counterfeiting
GLOBALFOUNDRIES And GlobalWafers Sign MOU
SUSS MicroTec Purchases The Inkjet Printer Division Of Meyer Burger B.V.
EV Group Establishes Heterogeneous Integration Competence Center
Imec Demonstrates 24 Nanometer Pitch Lines With Single Exposure EUV Lithography
Picosun Delivers Multiple Production ALD Systems To Asia
Park Systems Announces $1 Million Dollar Nano Research Grant Fund
ASYMTEK And DIMA Products Now Entirely Represented In Switzerland By Neutec Electronic AG
Particle Measuring Systems Releases 20 Nm Syringe Sampler
Pfeiffer Vacuum Introduces Extremely Quiet, Dry Pumps
Infineon Withdraws Outlook For FY20
DISCO Presented With The Supplier Continuous Quality Improvement (SCQI) Award By Intel Corporation

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}