News Article
Spreading the heat
Honeywell develops high performance management material for advanced semiconductors
Honeywell has announced that it has developed a new thermal interface material to help manage heat produced by advanced semiconductors. The new product, called Honeywell PTM 3180, uses high-performance polymers and tailor-loaded filler technology to help optimize thermal performance, while making it easier for customers to store and work with the material.
“We are committed to sustaining leadership in thermal management technology to help customers meet the challenges of dealing with increasingly powerful and smaller semiconductors,” said Dr. Tim Chen, global business director for packaging for Honeywell Electronic Materials. “This new thermal interface material offers the ease of use and processing advantages over many current thermal materials, while providing superior handling and re-workability.”
As semiconductor chips become more powerful and smaller, more heat is being generated in a confined space when semiconductor chips are packaged for use in computers and other applications. This tremendous heat can damage the semiconductor or degrade its performance. Honeywell’s thermal management materials are designed to help dissipate this heat by filling the gap between the semiconductor chip and the heat spreader. Honeywell PTM 3180 is a highly thermally conductive Phase Change Material (PCM), which remains solid at room temperature for the ease of application. It becomes semi-fluid when exposed above a certain temperature, providing excellent wet-out characteristics to fill the surface irregularities and air gaps between the heat spreader and the chip.
Based on a novel polymer PCM system, the new material exhibits excellent wetting characteristics at interfaces during typical operating temperature ranges, minimizing contact resistance and enhancing heat dissipation. It is designed to, maintain excellent performance through reliability testing, and provide scalable application at a competitive cost. The material is available in both pad and dispense formats.
“This new product adopts our proprietary formulation, which meets the multiple challenges for thermal materials such as robust thermo-mechanical reliability performance, excellent compressibility for gap filling and warpage control, and no pump-out or degradation after power cycling,” said Chen.
Honeywell PTM 3180, which exhibits phase change at 45 degrees Celsius, was developed to create the interfacial performance required for the entitled thermal conductivity and designed to effectively reduce the surface contact resistance. Product delivery mode can be tailored to application. Current offering is roll format taped pads of 10 mil (0.025 mm) thickness supplied between liner films.
“We are committed to sustaining leadership in thermal management technology to help customers meet the challenges of dealing with increasingly powerful and smaller semiconductors,” said Dr. Tim Chen, global business director for packaging for Honeywell Electronic Materials. “This new thermal interface material offers the ease of use and processing advantages over many current thermal materials, while providing superior handling and re-workability.”
As semiconductor chips become more powerful and smaller, more heat is being generated in a confined space when semiconductor chips are packaged for use in computers and other applications. This tremendous heat can damage the semiconductor or degrade its performance. Honeywell’s thermal management materials are designed to help dissipate this heat by filling the gap between the semiconductor chip and the heat spreader. Honeywell PTM 3180 is a highly thermally conductive Phase Change Material (PCM), which remains solid at room temperature for the ease of application. It becomes semi-fluid when exposed above a certain temperature, providing excellent wet-out characteristics to fill the surface irregularities and air gaps between the heat spreader and the chip.
Based on a novel polymer PCM system, the new material exhibits excellent wetting characteristics at interfaces during typical operating temperature ranges, minimizing contact resistance and enhancing heat dissipation. It is designed to, maintain excellent performance through reliability testing, and provide scalable application at a competitive cost. The material is available in both pad and dispense formats.
“This new product adopts our proprietary formulation, which meets the multiple challenges for thermal materials such as robust thermo-mechanical reliability performance, excellent compressibility for gap filling and warpage control, and no pump-out or degradation after power cycling,” said Chen.
Honeywell PTM 3180, which exhibits phase change at 45 degrees Celsius, was developed to create the interfacial performance required for the entitled thermal conductivity and designed to effectively reduce the surface contact resistance. Product delivery mode can be tailored to application. Current offering is roll format taped pads of 10 mil (0.025 mm) thickness supplied between liner films.
