News Article
Stripping asher defects away
FSI International announces expansion of all wet stripping technology into NAND memory manufacturing
FSI International has announced that a major memory manufacturer has extended the use of its ZETA Cleaning System with proprietary ViPR all-wet, ashless cleaning technology to NAND production. Many device manufacturers are already familiar with the benefits of using FSI’s ZETA ViPR technology for salicide formation. This IC maker evaluated the tool’s all-wet photoresist removal capability to eliminate an asher-induced defect in advanced NAND fabrication. The customer confirmed in manufacturing the tool’s ability to strip photoresist without ashing and has now replaced a two-step, ash-clean process with a single-step. In addition to reduced defectivity, users are benefiting from decreased total factory turn around time by going to a one-step process.
“NAND technology continues to set the pace for shrinking device dimensions,” said Don Mitchell, FSI’s president and CEO. “Expanding the ZETA ViPR for NAND manufacturing verifies the critical value-add of all-wet stripping in advanced processes— value that will only increase as device dimensions continue to shrink. It’s rewarding to provide our customers with a truly differentiated process that can reduce cycle time and capital outlay and lower operating costs.”
“NAND technology continues to set the pace for shrinking device dimensions,” said Don Mitchell, FSI’s president and CEO. “Expanding the ZETA ViPR for NAND manufacturing verifies the critical value-add of all-wet stripping in advanced processes— value that will only increase as device dimensions continue to shrink. It’s rewarding to provide our customers with a truly differentiated process that can reduce cycle time and capital outlay and lower operating costs.”
