News Article
New mark for temperature control
Nextreme breaks temperature barrier with microscale heat pump enabling pinpoint thermal management at the heat source.
Nextreme Thermal Solutions has announced that the OptoCooler HV14 is the industry's first high voltage, low current thin-film thermoelectric cooler (TEC) targeted at laser diode cooling for the telecommunications market to achieve a 60°C temperature difference between its cold and hot sides. This temperature difference reflects the ability of the device to pump heat efficiently. For customers in the optoelectronics and telecommunications industries, this translates to improved cooling performance, lower input power requirements and greater efficiencies for solving thermal management issues in electronic packages.
The OptoCooler HV14 thermoelectric cooler is the first module in a new class of high voltage and high heat pumping thermoelectric coolers that operate at low currents and are optimized for standard circuitry and power requirements. The device can pump up to 1.5W of heat at 85°C and operates at a maximum voltage of 2.7 with a maximum current of around 1A; with a footprint of only 2.8mm2. The module is ideally suited for the cooling and temperature control of optoelectronic devices such as laser diodes for transmission modules and photodiodes for sensing.
"The most efficient thermal management system involves embedding thermal management functionality at the source of the heat," said Dave Koester, vice president of engineering at Nextreme. "Introducing localized cooling in the package translates to a greater cost savings at the device and system levels."
The OptoCooler HV14 thermoelectric cooler is the first module in a new class of high voltage and high heat pumping thermoelectric coolers that operate at low currents and are optimized for standard circuitry and power requirements. The device can pump up to 1.5W of heat at 85°C and operates at a maximum voltage of 2.7 with a maximum current of around 1A; with a footprint of only 2.8mm2. The module is ideally suited for the cooling and temperature control of optoelectronic devices such as laser diodes for transmission modules and photodiodes for sensing.
"The most efficient thermal management system involves embedding thermal management functionality at the source of the heat," said Dave Koester, vice president of engineering at Nextreme. "Introducing localized cooling in the package translates to a greater cost savings at the device and system levels."
