News Article
3DIC TSV JV
EV Group and CEA/Leti Partner to accelerate adoption of TSV and 3D integration technology
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has announced it has entered a joint development program (JDP) with CEA/Leti, a European research lab focusing on microelectronics and nanotechnology. EVG will provide CEA/Leti with its world-class, 300-mm temporary bonding and debonding technology. The first system will be shipped in May. The joint development work will focus on further developing these technologies and processes to accelerate continued adoption of TSV technology - given its demonstrated advantages, which include higher performance, increased functionality, smaller footprint and lower power consumption.
Flash memory and image sensors continue to lead the charge implementing 3D IC/TSV technology due to the complexity of the device structure and demands for more functionality with lower power. In demonstrating a cost-effective, manufacturable stackable interconnection technology, experts project TSV adoption to grow intensively over the next few years expanding into various other advanced IC applications. This joint development program spearheads another critical step to readying integrated device manufacturers and foundries to fully implement 3D integration technology and processes into their production lines, and bringing this technology's advantages to a global commercial scale.
"We are extremely pleased to be working with EVG-not only for their proven bonding/debonding and thin-wafer handling technology systems, but also for the tremendous groundwork and expertise on tools for TSV technology and 3D integration they bring to the table, which complements our own know-how in this field," said Nicolas Sillon, the head of the laboratory for advanced packaging and 3D integration at Leti. "TSV and 3D integration is proving to be a viable solution to a critical roadblock in advanced device performance. Together we can continue to unlock the full potential of this technology to ensure widespread commercialization for high-volume applications."
Commenting on the announcement, Stefan Pargfrieder, EVG's business development manager noted, "CEA/Leti is a world leader in accelerating emerging technologies to widespread market adoption. We are thrilled to be working with such a prestigious institution, and believe their expertise will be crucial to this JDP and pushing TSV and 3D technology forward in the market place. We are seeing an increasing number of high-volume manufacturers exploring implementation of this technology in their production lines, and this joint effort with CEA/Leti will be instrumental in continuing this positive momentum."
This cooperation also strengthens the existing and established joint development activities between Brewer Science, EVG and Leti. Ultimately, it exemplifies the synergy between materials, equipment and process expertise, and further enables products and know how in the growing field of 3D IC/TSV technology, as well as other potential users of temporary bonding and debonding techniques.
CEA/Leti and EV Group have already commenced work on the project and have produced successful results in 3D applications using their TSV technology and processes.
Flash memory and image sensors continue to lead the charge implementing 3D IC/TSV technology due to the complexity of the device structure and demands for more functionality with lower power. In demonstrating a cost-effective, manufacturable stackable interconnection technology, experts project TSV adoption to grow intensively over the next few years expanding into various other advanced IC applications. This joint development program spearheads another critical step to readying integrated device manufacturers and foundries to fully implement 3D integration technology and processes into their production lines, and bringing this technology's advantages to a global commercial scale.
"We are extremely pleased to be working with EVG-not only for their proven bonding/debonding and thin-wafer handling technology systems, but also for the tremendous groundwork and expertise on tools for TSV technology and 3D integration they bring to the table, which complements our own know-how in this field," said Nicolas Sillon, the head of the laboratory for advanced packaging and 3D integration at Leti. "TSV and 3D integration is proving to be a viable solution to a critical roadblock in advanced device performance. Together we can continue to unlock the full potential of this technology to ensure widespread commercialization for high-volume applications."
Commenting on the announcement, Stefan Pargfrieder, EVG's business development manager noted, "CEA/Leti is a world leader in accelerating emerging technologies to widespread market adoption. We are thrilled to be working with such a prestigious institution, and believe their expertise will be crucial to this JDP and pushing TSV and 3D technology forward in the market place. We are seeing an increasing number of high-volume manufacturers exploring implementation of this technology in their production lines, and this joint effort with CEA/Leti will be instrumental in continuing this positive momentum."
This cooperation also strengthens the existing and established joint development activities between Brewer Science, EVG and Leti. Ultimately, it exemplifies the synergy between materials, equipment and process expertise, and further enables products and know how in the growing field of 3D IC/TSV technology, as well as other potential users of temporary bonding and debonding techniques.
CEA/Leti and EV Group have already commenced work on the project and have produced successful results in 3D applications using their TSV technology and processes.
