News Article
Measuring wafer temperature
KLA introduces next generation wafer temperature measurement system
KLA-Tencor has released its next generation in-situ plasma etch wafer temperature measurement product, the EtchTemp SensorWafer. The newest SensorWafer from KLA-Tencor’s SensArray division. EtchTemp offers new capabilities to characterize the high-power, high-frequency etch recipes proliferatingat 65nm nodes and below.
The EtchTemp SensorWafer enables etch engineers to further visualize, diagnose, and control their processes and process tools, through the significantly increased process measurement capabilities.
“One of the key challenges for etch engineers today is matching chambers to achieve consistent performance across the entire toolset. Additionally, smaller processing windows make chamber matching difficult, and higher RF power recipes make it harder to achieve Cpk (process capability) goals” said Larry Wagner, senior vice president and general manager SensArray division. “With this new tool, etch engineers will have an accurate and reliable means for capturing critical etch process data, as well as the ability to characterize a full range of RF power and frequencies for all chambers currently on the market.”
“One of the key challenges for etch engineers today is matching chambers to achieve consistent performance across the entire toolset. Additionally, smaller processing windows make chamber matching difficult, and higher RF power recipes make it harder to achieve Cpk (process capability) goals” said Larry Wagner, senior vice president and general manager SensArray division. “With this new tool, etch engineers will have an accurate and reliable means for capturing critical etch process data, as well as the ability to characterize a full range of RF power and frequencies for all chambers currently on the market.”
