News Article
Controlling 3D IC
Rudolph Technologies and SEMATECH extend 3D TSV collaboration at UAlbany NanoCollege
Rudolph Technologies and SEMATECH have announced that Rudolph has joined SEMATECH’s 3D Interconnect Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. The joint partnership is a continuation of collaborative efforts in process characterization, with a new focus on 3D IC (three-dimensional integrated circuits) processing and enhancing process control of TSV (through-silicon vias) manufacturing. This is the second year that Rudolph will serve as a Member of SEMATECH.
As a member of SEMATECH’s 3D program, Rudolph’s inspection and metrology technologies will be applied to various projects including via depth and CD metrology, metallization void detection, stacked wafer via alignment, wafer edge defect detection and bump height coplanarity.
“The advanced device design and complex manufacturing requirements of 3D packaging opens a new frontier of process control challenges. Rudolph is well positioned, both with existing and emerging technologies, to be the semiconductor industry’s premier TSV process control solution provider,” stated Ardy Johnson, Rudolph’s vice president of marketing.
Sitaram Arkalgud, director of 3D interconnect at SEMATECH added, “We are pleased to welcome Rudolph as a partner. Rudolph’s proven expertise in defect detection, characterization, and data analysis will be significant in developing technologies and processes that will continue to drive implementation of manufacturable and cost-effective 3D TSV processes.”
Richard Brilla, vice president for strategy, alliances and consortia at CNSE, said, “The addition of Rudolph Technologies’ innovative metrology and characterization capabilities will further enhance the leading-edge research being conducted as part of SEMATECH’s 3D Interconnect Program at CNSE’s Albany NanoTech. At the same time, it will build on the world-class research and development at the UAlbany NanoCollege, which is providing critical solutions for the world’s leading companies in the highly competitive global nanoelectronics industry.”
As a member of SEMATECH’s 3D program, Rudolph’s inspection and metrology technologies will be applied to various projects including via depth and CD metrology, metallization void detection, stacked wafer via alignment, wafer edge defect detection and bump height coplanarity.
“The advanced device design and complex manufacturing requirements of 3D packaging opens a new frontier of process control challenges. Rudolph is well positioned, both with existing and emerging technologies, to be the semiconductor industry’s premier TSV process control solution provider,” stated Ardy Johnson, Rudolph’s vice president of marketing.
Sitaram Arkalgud, director of 3D interconnect at SEMATECH added, “We are pleased to welcome Rudolph as a partner. Rudolph’s proven expertise in defect detection, characterization, and data analysis will be significant in developing technologies and processes that will continue to drive implementation of manufacturable and cost-effective 3D TSV processes.”
Richard Brilla, vice president for strategy, alliances and consortia at CNSE, said, “The addition of Rudolph Technologies’ innovative metrology and characterization capabilities will further enhance the leading-edge research being conducted as part of SEMATECH’s 3D Interconnect Program at CNSE’s Albany NanoTech. At the same time, it will build on the world-class research and development at the UAlbany NanoCollege, which is providing critical solutions for the world’s leading companies in the highly competitive global nanoelectronics industry.”
