News Article
Fujitsu outsource to TSMC
Fujitsu Microelectronics and TSMC to Collaborate on Leading-edge Process Technology
After a hectic week of announcements and changes Fujitsu Microelectronics have now announced they will collaborate with Taiwan Semiconductor on leading edge process technology production for the manufacturing of Fujitsu Microelectronics’ products. Under an agreement between the companies, Fujitsu Microelectronics will expand its 40-nanometer generation logic IC business with production at TSMC’s fabs.
Fujitsu also announced this week a massive reduction in profit expectations and complete reorganisation of the board of directors and management positions. Within tehse changes are the outsourcing of chip manufacturing to TSMC and a collaborative effort for future technology.
The collaborative effort will bring together Fujitsu Microelectronics’ IC design technologies, leading edge imaging and communication intellectual property (IP), and high-quality technical support to customers, especially in Japan, with TSMC’s foundry-leading process technology and capability. This advanced technology engagement should enable both companies to create new business for themselves and for their prospective customers.
The two companies also announced that they intend to initiate discussions on collaborative development of high-performance process technologies for 28-nanometer and below for Fujitsu Microelectronics’ product applications.
“From the aspect of its advanced process technologies and large-scale production capacity, TSMC is the most attractive semiconductor foundry partner”, said Haruki Okada, president of Fujitsu Microelectronics Limited. “By continuing to create our advantages in fine-pitch process technologies through this partnership, we can further grow our ASIC and ASSP(1) product businesses.”
“Fujitsu Microelectronics is clearly a world-class leader in advanced high-speed and low-power technologies, design engineering, and differentiated IP. Given TSMC's long-standing commitment to Japan's semiconductor market, and our on-going investment and dedication to advanced process technology, our collaboration with Fujitsu Microelectronics represents a new best-in-class solution for many system companies,” said Dr. Rick Tsai, president & CEO of TSMC.
Fujitsu also announced this week a massive reduction in profit expectations and complete reorganisation of the board of directors and management positions. Within tehse changes are the outsourcing of chip manufacturing to TSMC and a collaborative effort for future technology.
The collaborative effort will bring together Fujitsu Microelectronics’ IC design technologies, leading edge imaging and communication intellectual property (IP), and high-quality technical support to customers, especially in Japan, with TSMC’s foundry-leading process technology and capability. This advanced technology engagement should enable both companies to create new business for themselves and for their prospective customers.
The two companies also announced that they intend to initiate discussions on collaborative development of high-performance process technologies for 28-nanometer and below for Fujitsu Microelectronics’ product applications.
“From the aspect of its advanced process technologies and large-scale production capacity, TSMC is the most attractive semiconductor foundry partner”, said Haruki Okada, president of Fujitsu Microelectronics Limited. “By continuing to create our advantages in fine-pitch process technologies through this partnership, we can further grow our ASIC and ASSP(1) product businesses.”
“Fujitsu Microelectronics is clearly a world-class leader in advanced high-speed and low-power technologies, design engineering, and differentiated IP. Given TSMC's long-standing commitment to Japan's semiconductor market, and our on-going investment and dedication to advanced process technology, our collaboration with Fujitsu Microelectronics represents a new best-in-class solution for many system companies,” said Dr. Rick Tsai, president & CEO of TSMC.
