SMIC announces new scaling capacity
Semiconductor Manufacturing International Corporation (SMIC) has announced that it will extend its 45-nanometer bulk complementary metal–oxide semiconductor (CMOS) technologies to 40nm and 55nm geometries.
These new processes will complement SMIC’s existing offerings to support customer demand worldwide, including in the fast-growing China market. Applications include multimedia products, graphics chips, chipsets, and mobile devices such as handsets integrated with 3G/4G.
“Our 45nm technology has been implemented at SMIC’s 300mm facility in Shanghai ahead of schedule and we look forward to a similar result at these additional geometries,” said SMIC’s President and CEO, Dr. Richard Chang. “These new offerings provide our current and new customers a customized set of solutions to meet their diverse product design-in needs.”
