TSV to spur metrology sales
The market for Metrology/Inspection equipment for 3D Through Silicon Via (TSV) semiconductor packaging looms large, according to the report "3-D TSV: Insight On Critical Issues And Market Analysis," recently published by The Information Network.
The desire for smaller, lighter and more power efficient devices has led to stacking in the same package. With the use of Through Silicon Vias (TSVs), chips can be stacked upon each other to provide more computing process in a compact space. Once diced, the packaged semiconductor device can then be used in electronic products, such as cellular phones or other electronic devices.
"Our analysis shows that while the overall equipment market will grow at a compound annual growth rate of nearly 60% between 2008 and 2013, the Metrology/Inspection sector is expected to grow nearly 80%," noted Dr. Robert Castellano, president of The Information Network. "On the device side, TSVs for MEMS is expected to grow nearly 100% in this time frame."
Currently there are several approaches to forming vias during the wafer fabrication process and the IC packaging and assembly stage. Each step in the process requires metrology or inspection of the TSVs to ensure the performance of the ICs.
Not only that, but each discrete processing step requires a unique combination of metrology and inspection tools. Because TSV technology requires unique processing steps, such as wafer thinning, which aren't used in standard 2D ICs, new measurement tools and techniques need to be developed. Examples include voids and other defects between bonded wafers, overlay between wafers, and the impact of stress on the TSVs themselves.
A list of TSV measurement needs includes:
Alignment of chips for stacking – wafer level integration
Bond strength
Damage to metal layers
Defects after thinning including wafer edge
Defects in bonding
Defects in vias between wafers
Through Si via is a high aspect ratio CD issue
TSV Depth and Profile through multiple layers
Wafer thickness and TTV after thinning
The Information Network is a leading consulting and market research company addressing the semiconductor, LCD, LED, HDD, nano, and solar industries.
