Silicon wafers continue to rise
Worldwide silicon wafer area shipments increased during the second quarter 2010 when compared to first quarter 2010 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry. Total silicon wafer area shipments were 2,365 million square inches during the most recent quarter, a 7 percent increase from the 2,214 million square inches shipped during the previous quarter. New quarterly total area shipments are 40 percent greater than second quarter 2009 shipments and are at their highest levels ever.
"Total silicon shipped in terms of MSI has finally exceeded the high-water mark set in the second quarter of 2008," said Takashi Yamada, chairman of SEMI SMG and General Manager SUMCO. "We are encouraged by five consecutive quarters of growth in silicon shipments and expect silicon shipments to continue to trend with devices."
Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or "chips" are fabricated. All data cited in this release is inclusive of polished silicon wafers, including virgin test wafers, epitaxial silicon wafers, and non-polished silicon wafers shipped by the wafer manufacturers to the end-users.
The Silicon Manufacturers Group acts as an independent special interest group within the SEMI structure and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi, etc.). The purpose of the group is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.
