300mm Packaging Etch Order
Mattson Technology receives repeat order for etch system
Mattson Technology has announced that it received a repeat order for the Alpine etch system from a leading semiconductor manufacturer. The system, which is scheduled to ship in November 2010, will be used in the customer's leading-edge 300 mm packaging facility in Asia for advanced wafer-level packaging processes.
"The Alpine was again selected by this leading semiconductor manufacturer for its ability to provide the process and technology solution for key etch steps to meet this customer's advanced packaging requirements," said Rene George, vice president and general manager of Mattson Technology's Plasma Products Group. "The system's temperature and material removal control enable back-end wafer level packaging customers to address increasingly challenging integration processes related to wafer bumping and 3D packaging processes."
George continued, "The customer chose our reliable, high-productivity Alpine etch system based on its significant productivity and cost-of-ownership advantages over competitive systems for packaging applications. This repeat order validates Mattson Technology's strengthening position in the 300 mm packaging market. We look forward to supporting our long-time customer with state-of-the-art process technologies on cost-effective systems to address its development and production needs in advanced packaging."