News Article
Rudolph Receives First Order for Automated Macro Defect Inspection System
System designed specifically for processes that use through silicon vias (TSV) to connect multiple die in a single package
Rudolph Technologies, Inc. has received its first NSX 320 system order from one of the leading IC manufacturers. The NSX 320 Automated Macro Inspection System is designed specifically for advanced packaging processes that use through silicon vias (TSV) to connect multiple die in a single package. The system also provides critical inspection capabilities for edge trimming metrology, wafer alignment during bonding processes, sawn wafers on film frames and other TSV related processes.
“TSV technologies are really taking off as IC manufacturers seek to pack ever-increasing performance and functionality into smaller and smaller spaces,” said Rajiv Roy, Rudolph’s vice president of business development and director of back-end marketing. “The NSX 320 System addresses a common set of requirements defined by our customers in foundries, IDMs, fabless and equipment manufacturers. It provides critically- needed defect inspection capability for these radically new packaging processes—at full production throughputs and minimal cost of ownership
In addition to speed and sensitivity, the NSX 320 System incorporates Rudolph’s proprietary XSoft system software capabilities—including high- speed staging, on-the-fly image capture and a wide range of sensor and objective options—for ease of use
New features engineered into the NSX 320, include the ability to perform critical dimension measurement; the addition of 3D sensors for TSV depth or bump metrology; and the ability to flip wafers to allow inspection of both front and back surfaces.
