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News Article

3D integration tool nears potential

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Leti and Replisaurus reach next step to ECPR metallization process
CEA-Leti and Replisaurus Technologies., a developer of a metallization technology for integrated passives, copper pillars and 3D integration (TSV) and previous winner of EuroAsia Semiconductor Start Up Company of the year announced that they have completed a crucial step toward commercialization of Replisaurus’ innovative ElectroChemical Pattern Replication (ECPRTM) metallization process. In less than two years since launching their common lab at Leti, the two partners have optimized the ECPR master process (the master is a 200mm or 300mm silicon wafer filled with copper and sized for final structures to be patterned). The technology is now mature enough to be applied on customer target products for evaluation. 

ECPR is a cost-effective alternative to the dual damascene process that provides deposition of copper structures in excess of 3µm thick with 5µm or less spacing between features. It eliminates the requirement for CMP or photolithography equipment or related materials, as well as the need for solvents. 

The common lab team demonstrated an efficient high-resolution etching process offering near-vertical sidewalls of the copper patterns on the target wafer. The process has been optimized to ensure no sidewall defects all across the wafer, even at the extreme edges, and to achieve high aspect ratio, 2:1 or greater where line spacing is ≥ 3µm. Leti’s advanced capabilities enabled a nearly 100 percent process yield. The project also is strongly focusing on reliability studies to guarantee the same sub-micron resolution in the numerous filling/transfer/cleaning cycles during wafer processing.   
  
Replisaurus’ ECPR Applications Laboratory and Customer Demo Centre has been based at Leti’s facility in Grenoble since the fall of 2010. Improvements of each stand-alone module necessary for the ECPR process have been carried out through the Replisaurus/Leti common lab agreement. Leti and Replisaurus engineers also have demonstrated the ability to print copper lines aligned with sub-micron overlay tolerances. In the coming months, the demo centre will receive the first integrated ECPR production tool that gathers the master prefilling, the printing and the cleaning modules into an all-in-one system.
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