Centrotherm & Sematech To Develop Low Temperature Processing
Centrotherm thermal solutions has joined Sematech's Front End Processes (FEP) program.
Together, the firms aim to develop new low temperature processing techniques for next generation high-performance logic and memory devices.
With the constant miniaturisation of devices, new materials and novel device concepts are needed to reduce thermal budget process flows. For instance, to enable the introduction of high mobility semiconductors as the channel material of transistors, low temperature processes are critical to preserve the beneficial properties of channel materials.
Similarly, advanced memory technologies require superior isolation as well as low thermal budget oxidation approaches, particularly for metal oxide RRAM devices. Plasma-based processing techniques are an attractive option to help realise such low-thermal budget processes. They also enable the integration of new materials into emerging device technologies.
Centrotherm and Sematech's FEP research team, will together develop plasma-based low temperature techniques using Sematech test structures. The primary goal would be to demonstrate their applicability towards usage in high performance logic transistors and memory devices in sub 14 nm advanced technology nodes.
"Sematech provides centrotherm with an excellent test device and characterisation platform to help centrotherm identify and demonstrate applications for our tool," says Peter Augustin, CEO of centrotherm thermal solutions GmbH & Co. KG. "This collaboration will enable centrotherm to showcase low temperature processing capabilities to our customers and is part of our ct focus program to expand our Semiconductors & Microelectronics area."
"Sematech is pleased to welcome centrotherm as a partner," adds Raj Jammy, Sematech's vice president of emerging technologies. "Centrotherm's unique expertise in thermal solutions will complement our own device and process expertise. We will work together to develop practical and promising manufacturable solutions to address the emerging needs of the advanced transistor and memory markets."
The goal of Sematech's FEP program is to provide novel cutting-edge materials, processes, structural modules and electrical and physical characterisation methods to support the continued scaling of logic and memory applications.
