MEMS Market To Dominate IC Semiconductor Packaging
In terms of package unit shipments, the MEMS packaging
market is growing twice as fast ( at about 20% CAGR) than what is predicted for
the overall IC package market.
WLP / TSV platform is set to grow the fastest while lead frame and organic laminate based packages are poised to grow a comfortable 16% CAGR over the next 5 years to come.
There are plenty of MEMS and sensors used for recent smartphones. These include MEMS accelerometers, gyroscopes, pressure sensors, electronic compass magnetometers, multiple silicon MEMS microphones, FBAR / BAW filters & duplexers, RF switches and MEMS oscillators. According to a new report by Reportlinker.com, there is no doubt that MEMS content is growing faster than standard IC content.
CHANGING THE PARADIGM
With the packaging involved, it's all about
orchestrating the assembly of MEMS sensor and their related ASIC inside a
module. But this is costly as packaging, assembly, test and calibration steps
account for nearly 35% to 60% of a total MEMS packaged module's cost.
MEMS types of packaging are more complex than most
standard IC packages because they require "System-in-Package" type of
assembly.
Furthermore, most MEMS packages are connecting sensors to their final environment, bringing very specific constraints at the module level such as building a cavity, a hole in the substrate or metal lead for pressure sensor and microphones, an optical window for optical MEMS, a full vacuum hermeticity at the die level.
The application scope of MEMS is broad and very
diversified. Since its early beginnings, the MEMS industry faced the issue of
being a highly fragmented market, with no manufacturing standards clearly
emerging. Packaging always needed to cope with the very specific
end-applications requirements of MEMS modules.
Now though, the MEMS law , "One MEMS = 1 Device with 1 Process with 1 Package", is changing as several packaging platform standards are now clearly emerging (such as WLP & TSV interconnects, SiP module assembly based on molded or cavity packaging for instance.)
STANDARDS ARE ON THE WAY
While there are many developments happening for high
reliability, low cost MEMS packages in the automotive, medical and industrial
application space, the number of MEMS and sensors going into mobile, consumer
and gaming applications is expected to continue to skyrocket, driving
integration of an incredibly high number of MEMS and sensor devices in
unprecedented volume.
As a result, OSAT and wafer foundry players are getting more and more interest in MEMS module packaging, as volume and complexity of MEMS SiP modules is increasing dramatically, implying several key trend in this space:-IDMs needs to find second sources partners and qualify some OSATs in order to secure their supply chain-Standardization (coming from both foundries, OSAT, WLP houses or substrate suppliers) is critical and necessary to implement in order to keep the packaging, assembly, test and calibration cost of MEMS modules under control.
More than ever, system-level integration (including package co-design & software competencies, SiP module assembly, passive integration and 3D TSV / WLP capabilities) will be key to leverage a high added value solution to final OEM customers as well as an efficient infrastructure to support the high volume grow of consumer MEMS applications. There are many different players with different designs, and it's not likely we'll see one solution adopted by all the players. Expect to see a blooming of several "big niches" standards in the future, driven by the biggest and most successful players.
Many companies have been covered in the report. These include TSMC, Texas Instruments, STMicroelectronics, MEM Hitech, Unimicron, Tong Hsing Electronics, Silicon Sensing Systems, Rood Microtec and Panasonic.