Imec & Tohoku Uni To Enhance MEMS, MRAM & 3D Integration Technology
Tohoku University, based in Sendai, Japan and imec have
signed a collaboration agreement in the presence of his Royal Highness Prince
Philip of Belgium during the Belgian economic mission to Japan.
The two institutes will work closely together in common areas of research, learning from each other's expertise and leveraging each other's strengths.
The collaboration agreement sets the framework for
future collaboration projects between imec and Tohoku University where
students, research staff, and professors will be exchanged between both organisations.
What's more, the agreement enables the exchange of samples between imec and Tohoku University, and sets the lines for joint research on specific topics. In the past five years, the two partners have already collaborated on advanced interconnects, MEMS packaging and low-power sensor circuit readout design. In the future, the collaboration will be expanded to MRAM (magnetic random access memory) process technology, 3D integration technology, biosensors and wireless communication.
Imec aims to set up strategic collaborative relationships with world-class universities that excel in research areas where imec is also conducting studies, and where collaboration is mutually beneficial. The collaboration will also benefit from imec's 200mm and 300mm cleanroom facilities.
"A cross fertilisation between our research groups boosts creativity and innovation and accelerates the achievement of breakthrough results. In this way, we can continue to be an innovation engine globally offering top notch research 3 to 10 years ahead of industrial needs."
