CEA-Leti Using Soitec CVD Tool For Silicon Memory Research
Altatech, a subsidiary of Soitec, has installed an AltaCVD system in CEA-Leti's Silicon Technology Division.
The research centre will use it to develop advanced phase-change memory devices and high-k metal gates for the sub-20nm technology node.
This repeat order from CEA-Leti is the first equipment order received by Altatech Semiconductor S.A., since it became a subsidiary of Soitec earlier this year.
For its development work in phase-change memories, a promising solution for next-generation non volatile memory applications, CEA-Leti will use AltaCVD's technology to perform low-temperature deposition of binary and ternary alloys
With its tightly controlled stoichiometry, the system can create highly conformal thin films with thicknesses of 100nm or less. This ability to deposit advanced materials with very high uniformity and repeatability will also be used by CEA-Leti in creating high-k metal gates.
In recent times, CEA-Leti and Altatech have collaborated in several research projects involving advanced-materials deposition and the integration of next-generation semiconductor devices. For example, in 2011, CEA-Leti installed another AltaCVD system for use in creating high-k oxide gates.
"The AltaCVD tool provides both the flexibility and the performance we need to conduct our semiconductor research projects. Furthermore, its reactor technology opens new areas of exploration for advanced materials," said Olivier Demolliens, CEA-Leti's equipment asset manager.
"Our AltaCVD platform continues to demonstrate its
strengths in depositing next-generation materials at both R&D facilities
and commercial fabs," added Jean-Luc Delcarri, general manager of Altatech.
"Following the release of our advanced CVD systems for front-end and memory processing and the roll out of our deposition tools for TSV (through-silicon-via) isolation and conductive layers, we are now applying our proven technology in creating advanced memories and high-k metal gates."
The new AltaCVD system has been qualified for use by CEA-Leti, with Altatech's team providing process engineering and hardware support.
Capable of accommodating 200mm or 300mm wafers, the
AltaCVD system is a multi-chamber tool designed for plasma-enhanced or
metal-organic deposition of advanced semiconductor materials using liquid
precursors.
Using direct injection of liquid precursors and a
patented flash-vaporisation system, this system can operate over a wide range
of vaporisation and deposition temperatures, enabling users to select the
optimal process windows for their specific applications.
These can include deposition of advanced materials for high-k gate dielectrics, metal gate electrodes, capacitors and 3D integration. In thermal CVD or RF-enhanced deposition steps, low-frequency plasma enables tuning of the thin film's mechanical, electrical and optical properties.