News Article
Mattson Annealing Tool Shipped For Advanced Logic Devices
Mattson Technology, Inc. , a supplier of advanced process equipment used to manufacture semiconductors, has shipped its Millios millisecond annealing (MSA) system to a major semiconductor manufacturer.
This is the second Millios purchased by this customer and will be installed in the chipmaker's newest fab for the development and production of advanced logic devices.
The Millios millisecond (ms) anneal system is specifically designed for ultra-shallow junction formation, advanced silicides and other processes requiring extremely short anneal times with precise control. The tool features a direct temperature measurement and control throughout the ms-anneal cycle. The proprietary design of the front side temperature control enables device manufacturers to achieve excellent performance for advanced technology nodes.
Millios enables a variety of applications due to its flexibility with process temperature, peak width and standard spike anneal heating. A temperature range from 250°C to 1350°C covers process applications from NiSi formation through advanced Ultra-shallow junction annealing.
"The mobile electronics era demands ever-smaller chips with high-performance and low power consumption, which is set at the transistor fabrication stage," said Johannes Keppler, MSA and RTA business leader of Mattson Technology's Thermal Products Group.
"The system's ability to perform selectable short time scale processing enables our customers to meet the more stringent device performance for today's transistor fabrication in a single high-speed step to minimise cost and maximise efficiency. The Millios was designed to deliver the industry's highest throughput and lowest cost of ownership at leading-edge technology nodes. We look forward to supporting our customer with this high-performance millisecond annealing tool to produce leading-edge logic chips for today's advanced electronics devices," he continued.
