Rudolph sells metrology system to display maker
Rudolph Technologies clinches deal with manufacturer of mobile device displays and enters discussions with large panel TV display makers.
US-based microelectronic equipment provider, Rudolph Technologies, has sold the first of its new MetaPULSE FP thin film metrology systems to a major manufacturer of flat panel displays (FPD) for handheld mobile devices, including tablets, e-readers and smart phones.
The system uses Rudolph's proprietary PULSE Technology to measure the critical thickness of metal layers deposited during the manufacturing process, providing the process control needed to enhance process yields and product quality.
"The MetaPULSE FP system allows for measurement of critical metal film thicknesses on actual product structures without contacting or destroying the device," says Dr Avishai Kepten, vice president and general manager of Rudolph's Metrology Business Unit. "The first tool is being qualified on an R&D line, and we believe the capability will be indispensable as [manufacturers] ramp to high-volume production."
As Rudolph's director of metrology product management, Tim Kryman, explains, MetaPULSE technology has been widely used to measure the thickness and other properties of thin metal films in semiconductor manufacturing applications.
"The new FP system combines a MetaPULSE measurement head with customised glass substrate handling to extend this critical measurement capability to the much larger substrates used to make flat panels," he says. "This MetaPULSE FP tool is being used for measurements on 4.5 generation substrates (790mm by 930mm), which are used to make displays for e-readers, tablets, phones and other mobile devices. We are also in discussions with manufacturers of much larger panels used for television displays."
Today, most large FPD manufacturers use an active matrix technology that involves fabricating the thin-film transistors (TFT) in either amorphous or polycrystalline silicon applied to the rear of the glass, which is very similar to those used during semiconductor manufacturing.
A typical TFT process includes the deposition of a series of gate metals such as Cr, Ta, Al, Mo, Ta, as well as deposition of Ti and/or Al source and data lines.
According to Rudolph, application studies for traditional and advanced FPD manufacturing processes have proven that PULSE is the only technology that can provide non-contact, non-destructive measurements of these metals, individually or in a multi-layered film stack, with gauge capability.
Process control of these layers is directly related to panel performance and process yield. With the development of the first MetaPULSE FP system, Rudolph engineers have successfully separated measurement and substrate handling functions.
"Ongoing development activity is focused on repackaging the PULSE measurement head with larger substrate handling to accommodate the full range of FPD sizes currently in production," adds Kepten. "Our goal is to provide this critical metal metrology for all generations of FPD manufacturing."
