Bruker wins major 3D microscope deal
A leading semiconductor supplier has purchased multiple Bruker ContourGT-X 3D optical microscope systems for its packaging factories in Asia and North America to support copper wire bond inspection and process control needs.
The ContourGT-X is claimed to lower manufacturing costs and assist in solving critical problems impacting the entire semiconductor industry as it transitions to copper-based processes from more expensive gold-based processes.
"Since copper is harder and more brittle than gold, our customers need to precisely monitor the correct amount of force applied to the bond connecting the die to the package lead-frame or substrate," says Mark R. Munch, Ph.D., President of the Bruker Nano Surfaces division. "This multiple-system purchase shows that the combination of automated run-time metrology, robust data analysis and ease of use for the operators is being recognised as a good solution for labour, process and material cost savings in Cu-wire bond qualifications."
"In addition to the inherent 3D optical metrology advantages of the ContourGT-X, we have added a lot of features that are specifically designed to aid wire bonding applications," explains Rob Loiterman, Executive Vice President and General Manager of Bruker's Stylus and Optical Metrology business.
"For example, a line engineer can create specific recipes that are automatically linked via operator ID, material ID, or lot/inspection ID. These software controls provide accurate real-time identification and flagging of good and bad product so our customers can ensure the reliability of their products, while taking advantage of the lower cost of copper," concludes Loiterman.
