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News Article

CGI Americas Reveals Multifunctional Wafer Lamination System

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CGI Americas has unveiled a new vacuum lamination system for applying dry films to wafers which it says exhibits superior accuracy, fill capability and precision.

The WVL"A12D from C Sun incorporates a unique cutter design and consists of a pre"cutting module, lamination module, levelling module, and de"taping module.

The tool is suited a number of applications including TSV and RDL processes for 3D IC packaging, underfill lamination, molding, CMOS image sensor manufacturing, LED silicon submount packages and MEMS substrate manufacturing.

The firm says the WVL"A12D system represents a new and highly cost effective method to increase manufacturing yields and reduce costs by reducing contamination through a number of unique technologies.

CGI says it has a strong presence in the packaging field and that this system sells for $800K as opposed to $1.2-$1.5 million for competitive products.

So far, systems have been installed at several large Taiwanese semiconductor manufacturing facilities including TSMC.
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