News Article
KLA Upgrades Its IC Reticle Inspection Systems
KLA-Tencor Corporation has added two tools to its IC fab-based reticle inspection portfolio: the X5.2 and Teron 611 systems.
The X5.2 captures defects and pattern degradation on masks currently in production, with extended capability for the upcoming 20nm mask set and full mask sets at the 28nm and larger design nodes . The Teron 611 is designed for the 20nm node and beyond.
Both instruments enable early detection of pattern degradation from cleaning or exposure, alerting engineers to process window narrowing before the point of collapse. The X5.2 and Teron 611 also feature fifth-generation STARlight inspection mode for full area coverage on multi- and single-die reticles. This allows preferential defect capture on edges and sidewalls of patterned and open areas.
Advanced algorithms provide reliable discrimination between nuisance events and defects of interest and sensitivity may be adjusted allowing fab's changing product mix, product life cycle and yield status to be analysed rapidly. Both systems also feature unique connectivity to KLA-Tencor's e-beam defect review platform, the eDR-7000, enhancing speed and accuracy of on-wafer defect population profiling.
"New cleaning processes and smaller pattern features on the mask have altered the landscape for reticle monitoring in the fab. Primary and assist pattern features are not only smaller at the 20nm node, but the distinction between them is becoming blurred - making it more difficult to determine whether a defect will affect the pattern on the wafer, " says Yalin Xiong, Ph.D., general manager of the Reticle Products Division at KLA-Tencor.
He adds, "Our customers are also increasingly concerned with the effect of mask pattern degradation on the process window - a result of repeated cleaning and exposure. We have designed the X5.2 and Teron 611 inspection systems to comprise a Total ReQual solution, monitoring defectivity and pattern degradation down to the 20nm node and beyond."
KLA says the X5.2 and Teron 611 systems have been shipped to leading chip manufacturers in the United States and Asia, where they are being used in 28nm production and 20nm pilot line.
