Major Foundry Buys Mattson Tech Helios XP RTP System
Mattson Technology, Inc. has shipped its first follow-on Helios XP rapid thermal processing (RTP) system to a major foundry customer.
The Helios XP will be used in the foundry's most advanced fab for the volume production and development of integrated circuits (ICs).
"The Helios XP was designed to address both the technical and economic challenges associated with the shrinking geometries required for the manufacture of advanced mobile device chips," says Johannes Keppler, business leader of Mattson Technology's Thermal Products Group.
"The system features a state-of-the-art temperature measurement and control system that delivers unparalleled reliability and ultra-low temperature processing performance for advanced materials formation that enable next-generation IC fabrication," adds Keppler.
He concludes, "The follow-on order from this major foundry expands our Helios XP installed base and further extends our position in the foundry space. We look forward to continue delivering innovative thermal tools that provide proven reliability, low CoO and leading-edge process control to support our customer in its development and production of advanced chips for the mobile electronics era."