Shenyang Silicon Acquires EVG's 300mm SOI Bonding System
Austrian headquartered EV Group (EVG) has announced that Shenyang Silicon Technology Co. Ltd. (SST) has successfully installed its EVG850LT 300mm system.
The tool will be used for the low-temperature automated production bonding of silicon-on-insulator (SOI) materials.
The China-U.S. joint-venture SOI wafer provider selected the 300mm bonder as a follow-on to its prior purchase of a 200mm EVG850LT.
The system has already shipped to SST's facility. EVG says this marks the first installation in China of a 300mm SOI wafer production tool.
"Our 200mm EVG850LT system has been instrumental in helping us fulfil customer requirements for high-performance SOI wafers," states Professor He ZhiQiang, CEO of SST. "As we look to advance our ability to produce 300mm SOI wafers in high volumes, we need technology that offers the same degree of reliability, throughput and quality as we experienced with our prior EVG bonder, so adding a 300mm version of the EVG850LT to our line was an easy decision to make."
A key enabling technology for the SOI wafer fabrication process, wafer bonding achieves high-quality, single-crystal silicon films on insulating substrates.
With the EVG850LT SOI production bonding system, all essential steps for low-temperature SOI bonding, from cleaning and alignment to pre-bonding and IR inspection, are combined to assure a high-yield production process for void-free 300mm wafers.
Swen Zhu, director of sales for EV Group in China, notes, "The demand for SOI-based devices continues to grow at a rapid pace, particularly in emerging markets such as China, creating more opportunity for EVG to extend our relationships with our customers producing SOI wafers. This follow-on order from SST serves both to strengthen our alliance and to extend EVG's proven leadership in providing advanced process technology for SOI wafer development."
