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News Article

Equipment & Material Semiconductor Revenues to Quadruple

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Demand for "˜mid-end' tools and related materials is surging, thanks to the growth of 3DIC & wafer-level-packaging technologies.

These include 3D TSV, FO WLP, 3D WLP, WLCSP, 2,5D interposers and flip-chip wafer bumping.



According to Yole Développement, the materials market will grow from around $590 million this year to over $2 billion by 2017 with a CAGR of 24 percent, driven mainly by the expansion of 2,5D interposers and 3D TSV& WLP platforms.

Also, the equipment market reached a value of about $870 million in 2011 with a CAGR of 28 percent fuelled by the 3D IC technology with TSV interconnects, which represents one of the main emerging areas in the coming years; an area offering opportunities for new equipment modification and new materials development.

A slight decrease in 2012 is forecast, since manufacturers invested in equipment tools dedicated to the 3D TSV & WLP markets last year and high-volume production in 3D TSV, FO WLP, and 3D WLP has not started yet. 

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