STATSChipPAC to branch out in Korea
The facility expansion integrates operations in South Korea and will support continued growth in advanced flip chip, advanced wirebond and 3D packaging
STATS ChipPAC plans to expand its semiconductor assembly and test operation in South Korea.
The company has signed a non-binding memorandum of understanding to invest in a new integrated facility in the Incheon Free Economic Zone, an international business district located in the Incheon metropolitan area that is adjacent to Seoul, South Korea.
The integrated facility will include approximately 95,000 square meters (1 million square feet) of land with options for future expansion. The integrated facility will be used for manufacturing, research and development, and administration.
Construction is scheduled to begin in the third quarter of 2013 and the new facility is expected to be operational in the second half of 2015. STATS ChipPAC intends to integrate its existing facilities in South Korea into the new, larger facility to achieve a more efficient, cost effective manufacturing flow and provide flexibility for future expansion.
"STATS ChipPAC Korea is an important strategic manufacturing operation with an illustrious history of delivering the most advanced packaging and test technologies with proven manufacturing capabilities that extend back over 27 years to when the factory was first established," says Tan Lay Koon, President and Chief Executive Officer, STATS ChipPAC.
"We are very confident that our expansion in South Korea will increase our overall competitiveness in advanced flip chip, advanced wirebonding and three dimensional (3D) packaging technologies where we have established a strong leadership position in the industry. The expansion and integration of our operations in South Korea align with our ongoing growth over the last several years in advanced technologies for the electronics mobility and convergence markets," adds Koon.
STATS ChipPAC Korea's sizeable flip chip technology portfolio ranges from large single die fcBGA packages with passive components used for graphics, CPU and ASIC devices to smaller fcFBGA packages including single die, multi-die and stacked configurations that combine wire bond and flip chip technology within a single package.
In terms of 3D technology, STATS ChipPAC Korea provides advanced Package-on-Package (PoP), Package-in-Package (PiP) and System-in-Package (SiP) technologies that integrate one or more integrated circuits or passives into a single solution for mobile, digital consumer and data storage applications.
"We are proud of the leadership position we have in advanced packaging technologies and the extensive manufacturing experience we have demonstrated over the years. We are excited to begin a new phase of expansion in South Korea with the opportunity to increase the level of manufacturing efficiency, capabilities and overall capacity for our customers," adds Sang-Jin Maeng, Managing Director, STATS ChipPAC Korea.
"We believe our strategic partnership with Incheon International Airport Corporation (IIAC) will facilitate our future growth in South Korea due to the exceptional business infrastructure in Yeongjongdo and close proximity to Incheon International Airport for accessibility and efficient supply chain logistics," concludes Sang-Jin Maeng.
