News Article
Plasma Etch Eliminates Green House Gases In PCB Manufacturing
Plasma Etch has developed and is now offering what it claims is the world's first truly green plasma etching system to be used in the manufacturing production of PCB'S (printed circuit boards).
The company has developed a technology called the Magna Series (patent pending) that eliminates the need of CF4 gas that is presently used daily by PCB manufacturers with the use of plasma etching systems for desmear and etchback processing applications.
CFC gases are harmful to the ozone layer. It is hard to determine the exact amount of Chlorofluorocarbon's being emitted daily, monthly or yearly by the use of plasma etching systems, however it is estimated to be a significantly substantial amount.
Plasma Etch says its Magna Series technology is an advancement in the protection of the global environment and preservation of our ozone layer. Specifically, the Magna Series technology eliminates the need of CF4 gases. What's more, the Magna Series technology will not require the use of O2 bottles (gas tanks) presently required.
Plasma Etch also stresses the Magna Series will require significantly less power than traditional plasma etching systems currently in use. The firm reports the Magna Series has also set new market standards in several other key areas. The new technology provides faster etch times, lower operating cost, and process uniformity not achievable using existing technologies.
As news of this new technology has spread, it is being welcomed with enthusiasm and encouragement from those within the printed circuit board community and from environmental groups and governmental agencies throughout the world.
Plasma Etch, Inc. has manufactured plasma cleaning, plasma etching, and plasma surface treatment systems for over 30 years. Its plasma systems are presently used for a multitude of purposes in the printed circuit board, semiconductor, medical, electronics, R&D, laboratory, manufacturing, and life sciences markets.
