STATS ChipPAC Ranked 6th For Semi Manufacturing Patent Innovations
Singapore headquartered firm, STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, has been ranked among the top 10 semiconductor manufacturing companies in the world for its patent portfolio and innovations.
The firm was honoured by the Institute of Electrical and Electronics Engineers (IEEE), the world's largest professional association for the advancement of technology, and 1790 Analytics, an Intellectual Property (IP) evaluation firm.
This is the second consecutive year that STATS ChipPAC has ranked among the top 10 semiconductor manufacturing companies in the world on the IEEE Spectrum's Patent Power Scorecard, a rating of the most valuable United States patent portfolios. STATS ChipPAC was ranked number 6 on the 2012 scorecard in the Semiconductor Manufacturing category.
STATS ChipPAC's strength in intellectual property (IP) and technology innovations are fundamental to the most advanced semiconductor integrated circuits (IC) in the market today. Recent advanced technologies developed by STATS ChipPAC that are rapidly gaining widespread traction across the semiconductor packaging industry include:
· Fine pitch flip chip packages with copper column bump featuring Bond-on-Lead (BOL) interconnection, both with Mass Reflow (MR) and Thermo-Compression Bonding (TCB) processes;
· Fan-out wafer-level packaging (FOWLP) that provides a breakthrough in package density and form factor together with the fan-in wafer level packaging option; and
· 2D/2.5D/3D integration solutions which deploy combinations of FOWLP and Through Silicon Via (TSV) schemes for seamless packaging solutions across the design space.
"The growth in the electronics mobility and convergence markets today is significantly driven by technology innovations. STATS ChipPAC is a leader in advanced packaging and our proven technology portfolio provides us with the capabilities to develop world class solutions for our customers through higher levels of IC integration, improved electrical performance, reduced power consumption, faster speed and smaller electronic devices," says Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.
He continues, "Over 60 percent of our patent portfolio comprises advanced or future technologies and our concentration of such enabling technologies had earned us a high ranking among the industry's top companies in semiconductor manufacturing. Through our strategic relationships with Original Equipment Manufacturers (OEMs) and semiconductor industry leaders, STATS ChipPAC's internal innovation teams are constantly collaborating with industry leaders to develop and enable the next generation of electronic devices."
"The visibility of new product trends and collaborations provide a channel that supports strong alignment between innovation and market demand to provide solutions that have a clear market proposition and application. We have an established IP licensing program to further provide our customers with multi-sourcing options to support supply chain strategies for their advanced products," adds Han Byung Joon.
