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Qualcomm reveals next generation Snapdragon mobile processors

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Qualcomm Incorporated has announced that its wholly owned subsidiary, Qualcomm Technologies, Inc., is sampling the first products in its latest generation of processors.

With the introduction of its newest Snapdragon 800 and 600 processors, Qualcomm says it is raising the bar on performance per watt and delivering unparalleled user experiences.

The Qualcomm Snapdragon 800 processors target premium mobile and computing devices. They are designed to deliver outstanding overall user experience, expand the possibilities of seamless connected computing and enable brand new mobile experiences while maintaining excellent battery performance.

These processors will deliver up to 75 percent better performance than the Qualcomm Snapdragon S4 Pro processor and the move to 28nm High Performance for mobile (HPm) technology node ensures exceptionally low power.

The new Krait 400 CPU in quad configuration, with speeds of up to 2.3 GHz per core enable processor performance to hold up to the more demanding processing and communication requirements of premium mobile devices.

What's more, asynchronous SMP architecture provides dynamic power sensing and control for peak performance per core, while extending battery life without the use of specialised cores.

The new Adreno 330 GPU delivers over twice the performance for compute applications over the current Adreno 320 GPU.

The 2x32bit LP-DDR3 at 800MHz features a memory bandwidth of 12.8GBps.

The new Hexagon DSP V5 delivers floating point support, dynamic multithreading and expanded multimedia instructions for enhanced low power performance.

New IZat location technology combines multiple tracking systems into a single high performance, highly accurate navigation platform for auto and pedestrian applications.

Qualcomm Snapdragon 800 processors offer fully integrated connectivity and a wide variety of communication options. They feature third generation a 4G LTE modem with data rates up to 150 Mbps (Category 4).

Furthermore, the 4G LTE Advanced Carrier Aggregation feature maximises radio frequency bandwidth and world multimode and multi-band supports use wafer level packaging (WTR1605).

The Qualcomm Snapdragon 800 processors also capture, playback and display in UltraHD video (with four times 1080p pixel density). The Dual Image Signal Processors (ISP) for Qualcomm Snapdragon Camera provide support for computational cameras. They also feature HD multichannel audio with DTS-HD and Dolby Digital Plus for enhanced audio and have higher display resolutions (up to 2560x2048) and Miracast 1080p HD support.

The Qualcomm Snapdragon 800 processors are currently sampling and expected to be available in commercial devices by mid-year 2013.

The Qualcomm Snapdragon 600 processor targets high-end mobile devices. These devices are designed to deliver great performance, rich graphics and enhanced user experience and will deliver up to 40 percent better performance than the Qualcomm Snapdragon S4 Pro processor at lower power.

The new processor offers system-wide architectural improvements, key component upgrades and expanded connectivity options. The Qualcomm Snapdragon 600 processor features a new Krait 300 quad-core CPU with speeds up to 1.9GHz, a new speed enhanced Adreno 320 GPU and support for LPDDR3 memory.

The Qualcomm Snapdragon 600 processor is sampling now and is expected to be available in commercial devices by second quarter 2013.

"With the overwhelming success of our previous Qualcomm Snapdragon platforms, our mobile processors have emerged as the platform of choice for high-end mobile devices," says Steve Mollenkopf, president and chief operating officer of Qualcomm. "With more than 50 design wins already secured with the first products of the Qualcomm Snapdragon 600 and 800 processors, we are advancing our vision and setting the standard for excellence in mobile computing."

Qualcomm will demonstrate its Snapdragon 800 processors, as well as the newest devices powered by Snapdragon processors during CES 2013 (South Hall 3, Upper Level, Booth #30313), between January 8th and 11th.


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