Automatic laser soldering of Schottky & bypass diodes possible
Berlin based firm PAC TECH has launched a new automatic laser soldering machine for the assembly of Schottky and bypass diodes.
The machine punches and forms lead frames, dispenses solder paste and performs diode laser attach to the lead frame. A final electrical and visual test is done on the assembled modules and chip packages.
With its experience in laser soldering and its innovative SB² and LAPLACE platforms, PAC TECH says it provides leading-edge technology for Laser Assisted Flip Chip and Solder Balling Equipment. In addition to standard machine platforms, PAC TECH designs and manufactures customised equipment solutions.
PAC TECH is an innovator in laser solder jetting and chip assembly/soldering for advanced microelectronic packaging. The firm's equipment product portfolio consist of SB²: Laser assisted solder ball jetting; Ultra-SB²: wafer/substrate level solder ball attach systems; Ultra-SB² 300 WLR: wafer/substrate level solder rework; Laplace: laser assisted flip-chip and die bonders; PacLine: automatic plating line for eless Ni/Au, Ni/Pd and Ni/Pd/Au for UBM and OPM.
The worldwide facilities in Europe, ASIA and USA offer the capability to do both: volume production and quick-time prototyping services.
PAC TECH also has a unique dual business model in which it offers its customers, especially low volume production customers or new starters in that industry the option to use in the initial phase PAC TECH's demo centres for services.
After qualification of the product the customer has the option of further cost reduction by having full turnkey solution with equipment, process and technology. This reduces the cost of a new product at introduction customer side and at the same time gives the customer the option to qualify and intensively study the technology and the cost of ownership.
Together with its partner and main shareholder NAGASE, PAC TECH is also developing embedding technologies for wafer and substrate level CSP technologies. The solder ball jetting equipment addresses markets like Hard Disk Drive, Camera Module, Sensors and Stacked TSV chip packages.
The eless plating line addresses applications in power MOSFET devices for clip attach, contactless RFID devices, High Reliability Power devices for Wire Bonding using Ni/Au and Ni/Pd respectively Ni/Pd/Au Over Pad Metallization.
Ni/Pd Metallization is qualified for volume production for low cost Cu Wire Bonding over active pad. The new Ultra SB² tool is addressing all wafer and substrate related solder ball applications in mass volume production.
PAC TECH has leading edge technology for Solder Ball Transfer, Minimum Solder Ball diameter is 30 µm. For eless Plating Tool PAC TECH is worldwide leading with more than 20 Automatic Tools installed worldwide.
