LASER illuminator enhances front and back IC images
With three laser wavelengths, the ULTRASPEC-III can illuminate the silicon surface and also be used for crisp high contrast backside imaging
ULTRA TEC has revealed a coherent laser illumination source which is designed to meet the needs of today's backside laser scan, photoemission microscopes and backside imaging stations.
In standard configuration with laser wavelengths at 660nm, 1064nm and 1300nm, the ULTRASPEC-III offers immediate flexibility to illuminate just the topside or silicon surface - and then switch to 1064nm (or 1300nm if you have a longer wavelength sensitive camera) for crisp high contrast backside imaging.
ULTRASPEC-III module
ULTRA TEC says the system has been shown to improve imaging effectiveness on many of the industry's best known brand analytical microscopes, including FA Instruments, Zeiss, Hypervision, Semicaps, and DCG Systems.
The patented system produces superior backside images through the silicon with phase-blended laser illumination, and opens the door to accurate remaining silicon measurement on backside thinned samples.
ULTRASPEC-III can be used to upgrade many microscopes
ULTRASPEC-III works alongside ULTRA TEC's ASAP-1 and ULTRAPOL sample preparation products, and the ARC-lite antireflective coating system - yielding both optimised prepared samples, and moreover, an optimised microscope illumination system for all FA and related requirements.
