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Tuesday 1st April 2014
The tools will be used for the volume production of advanced foundry/logic devices
Tuesday 1st April 2014
The new ApP Lite processor provides integrated sensing, data processing and wireless transmission
Tuesday 1st April 2014
ADI’s ADP5090 offers low-light power conversion and multiple power path management capability for energy harvesting systems
Monday 31st March 2014
The Aerosol Jet Micro-Dispense systems enable the production of miniature electronic devices
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Monday 31st March 2014
The accuracy and stability ensure lighter and thinner motion-sensing activity trackers for IoT applications
Monday 31st March 2014
The company says the tests prove that the patented circuit architecture developed by SureCore delivers greater than 50 percent power savings versus industry standard SRAMs
Friday 28th March 2014
The system will be added to the Dainippon Screen's 450mm cleaning tools installed in CNSU in New York
Friday 28th March 2014
These Avalanche Photodiodes are suited to optical range finding
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Friday 28th March 2014
The agreement will include Sonion having exclusive rights to sell InvenSense MEMS microphone products into hearing aids
Friday 28th March 2014
The companies have agreed to explore technical collaboration
Thursday 27th March 2014
The unison is aimed to optimise the integration of 14 nm Tri-Gate Stratix 10 FPGAs with heterogeneous technologies into a single system-in-a-package
Thursday 27th March 2014
The company is to support electronics engineers of the future through the UKESF Scholarship Scheme
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Thursday 27th March 2014
A new device may boost the resilience of low-cost and energy-efficient future digital circuits
Wednesday 26th March 2014
SoC technology is making in-roads into automotive, energy, and industrial electronics. Emerging applications that facilitate the “Internet of Things” is also lending traction to market growth
Wednesday 26th March 2014
The new technology could be employed in a number of applications including the examination of integrated circuits
Wednesday 26th March 2014
The firm's UV laser systems are suited for fabricating complex 2-D and 3-D structures (MEMS, MOEMS and micron-scale devices). Heat-free laser ablation facilitates exact tolerances without collateral damage to the material

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