Info
Info
News search:

< Page of 408 >

News


Wednesday 12th February 2014
The organisations demonstrated the chip at ISSCC2014. It signals an important achievement in enabling implantable cardiac monitoring solutions
Wednesday 12th February 2014
At the 2014 IEEE International Solid-State Circuits Conference, the firm presented its XLL SRAM chip
Wednesday 12th February 2014
The firm's power conversion solution with multi-level pulsing enables exceptional Pplasma management for PECVD, PEALD, and advanced etch applications
Wednesday 12th February 2014
If it does, IC Insights believes it would be a win-win situation for both companies
Info
Wednesday 12th February 2014
ASML Holding N.V., Canon Inc., Nikon Corp., and NuFlare Technology Inc. are the key vendors analysed in the report, "Global Lithography Systems Market 2014-2018"
Wednesday 12th February 2014
Wednesday 12th February 2014
The company is expanding to meet increasing business demands in the region
Wednesday 12th February 2014
The collaboration provides access to innovative IP for high-performance SoC designs for mobile and consumer applications
Wednesday 12th February 2014
This is despite the strongest sequential growth in four years with 9 percent quarterly growth
Wednesday 12th February 2014
The firms have made a settlement on pending patent litigation
Info
Tuesday 11th February 2014
The thyristor market will be worth $3.20 billion by 2018
Tuesday 11th February 2014
The firm's new technology system is targeted for logic and memory advanced packaging applications
Friday 7th February 2014
The single-chip FTIR spectrometer, which can measure thickness and composition has won an award for 'Test, Measurement, Metrology' in the Prism Awards for Photonics Innovation
Friday 7th February 2014
A new development paves the way for multifunctional spintronic smart sensors for use in military applications and next-generation spintronic devices
Friday 7th February 2014
Ballistic transport in graphene could result in a new class of room temperature coherent electronic devices which would be very different from what we make today in silicon
Info
Thursday 6th February 2014
The firm's Global 1 is claimed to be the first silicon based CMOS power amplifier to deliver GaAs-level performance for LTE devices
Thursday 6th February 2014
A new development can give a virtual insight into atomic-level ALD which offers a large-scale opportunity for the semiconductor industry
Thursday 6th February 2014
The new T5503HS test system provides high performance with low cost of test in an upgradeable design
Thursday 6th February 2014
Thursday 6th February 2014
Thursday 6th February 2014
European scientists will use compound semiconductors indium gallium arsenide and silicon germanium and design concepts to demonstrate a working prototype of a new type of 3D-stacked hybrid SRAM cell

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info