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Thursday 12th December 2013
The Semiconductor Manufacturing Technology business group faced a declining market - particularly at the beginning of the reporting period, with a slight recovery being evident in the second half of the year
Thursday 12th December 2013
Although complete high-quality 2.5D (Silicon Interposer) and 3D silicon devices can be manufactured, the final packaging flows are lacking
Thursday 12th December 2013
TrendForce says capacity at the Wuxi fab in October and November was 30K and 70K wafers per month, respectively. A target capacity of 100K is set for December, and the plant is expected to return to fully loaded 130K wafers per month in January 2014
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Wednesday 11th December 2013
The institute's replacement process on 300mm silicon wafers envisages a possible evolution of the FinFET/trigate architecture for 7 and 5nm CMOS technologies
Wednesday 11th December 2013
SMART Low Energy Electronic Systems Group will leverage the EVG 850LT in advanced compound semiconductor research for wireless ICs, power electronics, LEDs and other application
Wednesday 11th December 2013
 The MIPI eTrak-compatible RFeT offers seamless integration with pure CMOS-nased MMMB PAs for 3G and 4G/LTE cellular handsets
Wednesday 11th December 2013
The firm's highly integrate sub-GHz Si106x/8x family is iIdeal for power-sensitive, battery-powered systems with RF connectivity
Tuesday 10th December 2013
In 2013, the booming DRAM market propelled strong growth for memory makers and the semiconductor industry in general
Tuesday 10th December 2013
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Tuesday 10th December 2013
The companies have agreed to settle all outstanding disputes
Monday 9th December 2013
A new collaboration will focus on Leti's sequential 3D technology which is aimed at processing all functions in a single semiconductor manufacturing flow
Monday 9th December 2013
Sandwiching a piezoelectric material between silicon layers in a transistor means that the device is only put under pressure when necessary
Monday 9th December 2013
DARPA’s iPhoD program has concluded with a demonstration of low signal loss records with microchip-scale, integrated waveguides for photonic delay
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Monday 9th December 2013
The provider of patented, low-temperature direct bonding technology for 3D integration, has sold its 3D IC development lab to Tezzaron. Wholly owned subsidiary of Tezzaron, Novati Technologies will operate the facility
Friday 6th December 2013
Japan is said to represent the largest regional semiconductor fabrication material market. Taiwan, thanks to a strong semiconductor foundry base, ranks as the fastest growing market with a CAGR of 5.3 percent
Friday 6th December 2013
  Due to the geometry of III-V nanowires, they could be grown directly on silicon chips in a way that alleviates restrictions due to crystal lattice mismatch - thus yielding high-quality material with the potential for high performance. If a number of hurdles are overcome, possible applications include.integrated photonics, on-chip optical interconnects amd optical transistors to speed up computers
Friday 6th December 2013
  The thermal slide, thin-wafer handling debonder is suited for use with thinned silicon and III-V compound semiconductor substrates
Thursday 5th December 2013
Sales for 2013 are set to be the highest ever. Worldwide sales increased for eighth straight months and topped $27 billion for the first time ever in October; WSTS forecasts project a growth of 4.4 percent in 2013 and 4.1 percent in 2014
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