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Tuesday 15th October 2013
ASM220 is suited to OFDM PLC machine-to-machine applications
Tuesday 15th October 2013
Tuesday 15th October 2013
This move is expected to accelerate InvenSense's audio roadmap and expand its product portfolio and technology expertise
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Monday 14th October 2013
Monday 14th October 2013
The versatile MEMS device is suited to the automotive, industrial, and medical markets. The miniature SOIC-8 with broad absolute pressure ranges up to 100 PSIA allow for space constrained and cost sensitive applications
Monday 14th October 2013
The project will involve specialists in different technologies to merge electronics and polymers
Monday 14th October 2013
A new report indicates that growing cost pressures and developments in wafer reclamation processes are key driving forces in changing the future of the semiconductor industry
Monday 14th October 2013
Market research firm CIR sees the total chip-level optical interconnect market surpassing $1 billion in revenue in 2021 but silicon based devices may be outnumbered by compound semiconductor based PICs
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Friday 11th October 2013
Suited to the industrial-scale coating of 4” wafers, the company is providing the option for continuous deposition on reel-to-reel
Friday 11th October 2013
Analog Devices’ 3-axis high-G MEMS delivers more than twice the bandwidth at less than half the power consumption of competing sensors used to measure high-g events
Friday 11th October 2013
The IP family delivers up to a 10x faster conversion rate than available competing IP solutions and enables next-generation applications, such as WiGig (802.11ad). The broad IP family has offerings for consumer, mobile, infrastructure and industrial markets
Wednesday 9th October 2013
Valued at a massive $3 billion market, Yole predicts that combo sensors will almost triple from 2012 to 2013
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Wednesday 9th October 2013
Slashing the noise by a third of previous levels paves way to use of millimetre-band wireless communications terminals using silicon semiconductors
Wednesday 9th October 2013
Slashing the noise by a third of previous levels paves way to use of millimetre-band wireless communications terminals using silicon semiconductors
Wednesday 9th October 2013
Designed to support LTE smartphones, tablets and ultrabooks, the firm's recent design wins indicate a strong market acceptance of Its Envelope Tracking (ET) PAs. The devices are claimed to consume up to 25 percent less current in the newest LTE platforms
Tuesday 8th October 2013
A new system could expand computing capacity across both traditional and non-traditional domains
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