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Sunday 20th October 2013
An optical information carrier composed of tungsten and silicon nitride can store information for extremely long periods of time, with each bit being written using etching techniques
Sunday 20th October 2013
The company’s ticker symbol  will remain “FCS”
Sunday 20th October 2013
The new silicon based devices help battery pack designers simplify their design and minimise footprint area
Sunday 20th October 2013
The second phase of the trial addressing damages and wilfulness is set to begin
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Tuesday 15th October 2013
ASM220 is suited to OFDM PLC machine-to-machine applications
Tuesday 15th October 2013
Tuesday 15th October 2013
This move is expected to accelerate InvenSense's audio roadmap and expand its product portfolio and technology expertise
Monday 14th October 2013
Monday 14th October 2013
The versatile MEMS device is suited to the automotive, industrial, and medical markets. The miniature SOIC-8 with broad absolute pressure ranges up to 100 PSIA allow for space constrained and cost sensitive applications
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Monday 14th October 2013
The project will involve specialists in different technologies to merge electronics and polymers
Monday 14th October 2013
A new report indicates that growing cost pressures and developments in wafer reclamation processes are key driving forces in changing the future of the semiconductor industry
Monday 14th October 2013
Market research firm CIR sees the total chip-level optical interconnect market surpassing $1 billion in revenue in 2021 but silicon based devices may be outnumbered by compound semiconductor based PICs
Friday 11th October 2013
Suited to the industrial-scale coating of 4” wafers, the company is providing the option for continuous deposition on reel-to-reel
Friday 11th October 2013
Analog Devices’ 3-axis high-G MEMS delivers more than twice the bandwidth at less than half the power consumption of competing sensors used to measure high-g events

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