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Friday 5th July 2013
300mm wafer processing is forecast to rise to 70 percent of total capacity by 2017. But capacity for 450mm wafers will account for only one-tenth of a percent of global IC capacity during the same period. And for 200mm wafers, this is forecast to slip more than 10 points in December 2017
Friday 5th July 2013
The market analyst says that the next growth opportunities outside traditional IR detector markets are smart building automation and mobile phones. And companies such as Omron and Panasonic have used their MEMS technological know-how to dominate thermopile technology in the array detector market
Friday 5th July 2013
The firm will support the development of software for the evolving semiconductor industry
Friday 5th July 2013
Applying thin film diamond coatings at lower temperatures expands the options for electronic devices
Friday 5th July 2013
The conference will devote programs to major projects including 450mm wafer processing, power electronics, MEMS, and FDSOI
Wednesday 3rd July 2013
Although the majority of the $25 million funding for power devices will probably be used for wide band gap compound semiconductors gallium nitride (GaN) and silicon carbide (SiC), innovations could also make silicon a contender
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Wednesday 3rd July 2013
The firm's light source has achieved 2 hours of continuous operation. This milestone is bringing the firm another step closer towards reaching production level LPP EUV light sources
Wednesday 3rd July 2013
The company's AP300W system will be used for high-volume advanced packaging applications for communication devices
Tuesday 2nd July 2013
The F450C group has been set up to spearhead construction and infrastructure efforts for 450mm wafer fabs
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Tuesday 2nd July 2013
The material remains strong even under high temperatures and shows high chemical resistance. This makes it suitable for inner linings and heat shields in the high temperature industrial ovens used in semiconductor manufacturing
Tuesday 2nd July 2013
Thee firm's patents focus on wafer level packaging, Post Wafer fab Processing or mid-end processing, TSV, flip chip interconnect, integrated passive devices (IPD) and 2.5D/3D package integration
Monday 1st July 2013
Researchers over come fundamental law of optical science that could lead to Petabyte storage possible on a single disc
Monday 1st July 2013
The new MOSFETs will help designers achieve top power density and efficiency for telecoms and advanced computing solutions
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Monday 1st July 2013
The firm says its electroforming technology enables finer pitches
Monday 1st July 2013
The chip enables complex systems requiring large software and data sets, such as EMS

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