Info
Info
News search:

< Page of 406 >

News


Monday 1st July 2013
The plant closure will affect about 1,100 employees in Malaysia, approximately 11 percent of the firm's total global workforce
Monday 1st July 2013
The firm's three high-volume-production room-temperature debonding process types are supported by a supply chain of seven qualified adhesive suppliers to enable greater manufacturing flexibility
Friday 28th June 2013
FinFET transistors are among the 3-D microchip structures that could be measured using a new technique known as through-focus scanning optical microscopy (TSOM)
Info
Thursday 27th June 2013
Results show significant progress in developing a low-cost process technology to deposit III-Vs on top of silicon
Thursday 27th June 2013
The firm claims its Si50x CMEMS oscillators surpass quartz-based timing devices
Thursday 27th June 2013
The device will support METERS AND MORE open communication standard to enable broad smart-meter deployment
Wednesday 26th June 2013
MicroGen's BOLT power Cells use Linear’s LTC3588-1 piezoelectric energy harvesting conversion chip to power Dust Networks’ motes
Info
Wednesday 26th June 2013
The company's NovaMARS OCD software solution will be implemented in 1X NAND and 2X DRAM technology nodes
Wednesday 26th June 2013
The presentations will focus on innovative etch and deposition manufacturing solutions
Tuesday 25th June 2013
According to SEMI, the North American equipment industry in May 2013 book-to-bill ratio was1.08
Tuesday 25th June 2013
The acquisition strengthens SPTS' MEMS vapour release etch IP and product portfolio
Info
Tuesday 25th June 2013
According to microtechnology experts, China is currently very dependent on imports from Europe. And so in the short term, trading relations should be OK
Friday 21st June 2013
The 10MB ARM Cortex-A9 enables low-power, low-cost embedded display applications up to WXGA (1280x768) resolution. Renesas says the device removes the need for external DRAM memory
Friday 21st June 2013
DRAM and logic customers are pursuing DSA due to the high cost and delayed introduction of EUV lithography equipment, and costly multiple patterning techniques
Friday 21st June 2013
 The room temperature tunnelling behaviour of boron nitride (BN) nanotubes has been demonstrated with the aid of gold quantum dots
Friday 21st June 2013
Although the outlook for semiconductor equipment market is improving, it will remain soft in the short term

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info