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Tuesday 22nd February 2011
Joint research development for 22nm and below devices
Friday 18th February 2011
Chip packaging company aims to end agreement in long running dispute.
Friday 18th February 2011
Fab 42 will be the most advanced, high-volume semiconductor manufacturing facility in the world.
Wednesday 16th February 2011
Co-development demonstrated the efficiency of a system controller
Wednesday 16th February 2011
Semiconductor inventories swell to alarming level according to new research
Wednesday 16th February 2011
STATS releases copper enhanced packaging
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Monday 14th February 2011
Lab will open during the second quarter of 2011 in Taiwan
Friday 11th February 2011
CSR choose TSMC for its next-generation wireless products.
Thursday 10th February 2011
Acquisition Strengthens SPTS Development and Support Capabilities
Tuesday 1st February 2011
European semiconductor industry declared Europe’s most R&D intensive
Thursday 27th January 2011
IQE continues to support TriQuint Semiconductor in new US government contract for GaN based materials
Thursday 27th January 2011
Carbon nanotubes begin to make their mark
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Thursday 27th January 2011
ON Semiconductor signs definitive agreement to acquire CMOS image sensor business unit from Cypress
Tuesday 25th January 2011
Tight capacity forced semiconductor production efficiencies in 2010
Tuesday 25th January 2011
Advanced Micro-Fabrication Equipment Inc. prevails in patent infringement suit by Lam Research
Monday 24th January 2011
Semi Scenic starts taking on apprentices again as worldwide semiconductor market booms
Saturday 22nd January 2011
Ranks of leading-edge chip foundries dwindle
Thursday 20th January 2011
Gartner says top 10 accounted for $104.3 billion of semiconductor demand in 2010
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Thursday 20th January 2011
Dow Corning joins the imec GaN affiliation program
Thursday 20th January 2011
Research cooperation on ultra-thin films by Fraunhofer CNT and TU Dresden
Thursday 20th January 2011
Breakthrough in low temperature growth of carbon nanotubes
Wednesday 19th January 2011
Half a billion dollarsfor upgrade at Lexlip
Tuesday 18th January 2011
The University of Tokyo picks Docea Power to design NVM architecture as part of Japanese National Research Program
Monday 17th January 2011
CEA-Leti ramps up 300mm line dedicated to 3D-Integration applications

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