Qnity launches Emblem CMP Pad Platform
“For over 30 years, our customers have trusted our flagship CMP brands like IC1000™, Visionpad™ and Ikonic™ to meet their diverse CMP performance needs,” said Sanjay Kotha, Global Business Director, CMP Technologies, Qnity™, DuPont Electronics. “We are pleased to build on this legacy with the Emblem™ pad family, marking a new era of possibility in CMP materials through pad designs that are poised to set a new benchmark in performance, design flexibility and sustainability.”
Emblem™ 5171X CMP pad
Emblem™ 5171X is the first product from the Emblem™ platform, using a novel technology design to deliver step-out CMP performance. With multidimensional customization capabilities, pads from the Emblem™ platform like Emblem™ 5171X can overcome key CMP challenges for advanced nodes and deliver performance enhancements for higher throughput, planarization, and defect reduction. The design of Emblem™ 5171X also supports fab goals for operational efficiency through lower slurry and disk consumption and extended pad lifetime.
“The Emblem™ platform is already realizing its potential as a game-changing technology for advanced nodes through the launch of the Emblem™ 5171X pad,” said Randy King, Chief Technology and Sustainability Officer-Elect for Qnity. “In both internal and customer trials, Emblem™ 5171X is delivering critical improvements in CMP performance and efficiency without giving in to usual tradeoffs—improvements that were not possible with our previous CMP pad platforms. We look forward to continued Emblem™ product development with additional solutions to enable our customers’ next leaps in semiconductor design and manufacturing.”
Qnity will feature the Emblem™ CMP platform during SEMICON West, Oct. 7-9, in Phoenix, Ariz., and at the International Conference on Planarization Technologies (ICPT) Oct. 29-Nov. 1 in Hong Kong. Both events serve as a key opportunity to learn about Qnity Electronics, Inc., the future company planned to separate from DuPont on Nov. 1, 2025.*
