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Tuesday 6th March 2007
TranSwitch Corporation has announced a workforce reduction that is being implemented in two phases.
Tuesday 6th March 2007
Virtus Advanced Sensors (VAS) has announced the establishment of Virtus Asia Limited (VAL), an affiliated Hong Kong company which will focus on R&D, new product development, and sales and marketing in the Chinese Pearl River Delta and southeast Asian region.
Tuesday 6th March 2007
Reflect Scientific Inc. has announced the Company has completed the closing of the Agreement and Plan of Merger with Image Labs International (ILI).
Tuesday 6th March 2007
MOSIS has announced that it will introduce low cost access to the latest 65nm wafer fabrication technologies from IBM, including the foundry's low power and RF technologies.
Tuesday 6th March 2007
Taiwan Semiconductor Manufacturing Company, Ltd. has announced what it claims to be as the foundry's industry first functional 65nm embedded DRAM customer product.
Tuesday 6th March 2007
Asyst Technologies, Inc. has announced that Asyst's automated material handling system (AMHS) has been selected for Toshiba's newest Fab 4 in Yokkaichi, Japan.
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Monday 5th March 2007
Aeroflex Incorporated has announced that it has entered into an agreement to be acquired by General Atlantic and Francisco Partners in a transaction valued at approximately $1.0 billion.
Monday 5th March 2007
MOSIS has announced, prototype and low volume fabrication access to IBM's fourth generation foundry technology, 8WL, the 130 nanometre (nm) silicon germanium (SiGe) bipolar complementary metal oxide semiconductor (BiCMOS) process.
Monday 5th March 2007
Micronic Laser Systems AB announced that another Asian customer has ordered the company's newest tool, the FPS5100 laser pattern generator for advanced electronic packaging applications.
Monday 5th March 2007
Akros Silicon, a fabless semiconductor company has announced that it has secured $10.1 million in Series B financing led by Levensohn Venture Partners.
Monday 5th March 2007
Despite the traditional slow start for January, the European market was relatively stable in comparison with the sales reported in December, on a three months rolling average, in comparison to the weaker results reported from the other Regions.
Monday 5th March 2007
Applied Materials, Inc. has announced, it has been selected by Moser;Baer India Limited to develop and install in New Delhi, India, the first;Generation (Gen) 8.5 Thin Film Solar Module Production;Line.
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Monday 5th March 2007
Global-Tech Appliances announced approval for a capital appropriation for its wholly owned subsidiary, Global Optics Limited ("GOL"), in order to expand GOL's complementary metal oxide semiconductor (CMOS) camera module (CCM) manufacturing facility in Dongguan, China.
Monday 5th March 2007
PI (Physik Instrumente) has announced its 4th annual NanoInnovation Grant.
Sunday 4th March 2007
Good Energies and NorSun have established Sunfilm to manufacture, what they claim to be as, the world's first 5.7m2 tandem thin film photovoltaic modules on glass substrates on a production line supplied by Applied Materials.
Sunday 4th March 2007
Harvard University's Office of Technology Development (OTD) and Rohm and Haas Electronic Materials ( NYSE:ROH )have announced the signing of an agreement licensing to Rohm and Haas a novel class of metal amidinate compounds useful for making thin films of metals and metal compounds by atomic layer deposition.
Sunday 4th March 2007
ASML has announced that it has signed a contract with the Taiwanese Ministry of Economic Affairs (MOEA) to establish the ASML Centre of Excellence (ACE) near Taipei.
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Sunday 4th March 2007
Tower Semiconductor has announced that it was chosen by the Jet Propulsion Laboratory (JPL) to manufacture a CMOS image sensor for use in the development of its advanced MultiSpectral Polarimetric Imager (MSPI).
Sunday 4th March 2007
NXP Semiconductors has announced that its EDGE solution has been chosen by Lenovo Mobile Communication Technology, mobile handset manufacturer in China, to design its first EDGE mobile handset.
Friday 2nd March 2007
Isonics Corporation announced that it has received notification from the Nasdaq Hearings department that it has regained compliance with the market price requirements for continued listing on the Nasdaq Capital Market. The hearing originally scheduled for March 1, 2007, with the Nasdaq Hearings department has been cancelled.
Friday 2nd March 2007
Avanex Corporation has announced that it entered into a definitive agreement to sell a 90 percent interest in its French subsidiary, Avanex France S.A, including its Indium Phosphide (InP) and Gallium Arsenide (GaAs) semiconductor fabs to Global Research Company, a société à responsibilité limitée.
Friday 2nd March 2007
Arrowhead Research Corporation announced that Insert Therapeutics, its majority-owned subsidiary, signed a definitive agreement with R&D Biopharmaceuticals in which it will acquire an exclusive, world-wide license to multiple second generation epothilone anticancer drugs. Insert will apply its proprietary Cyclosert transport system to select second generation epothilones now in development at R&D.
Friday 2nd March 2007
Millbrook Scientific Instruments plc announces that its third MiniSIMS instrument to be supplied to Finland has been successfully installed and commissioned.

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