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Wednesday 28th March 2007
Taiwan Semiconductor Manufacturing Company (TSMC) has unveiled its 55nm process technology, a 90% linear-shrink process from 65nm including I/O and analogue circuits.
Tuesday 27th March 2007
Element Six Ltd (E6) is taking part in a major European Commission (EC) funded project aimed at developing new technologies for quantum computing.
Tuesday 27th March 2007
SUSS MicroTec announced that Infotonics has selected the SUSS ABC200 wafer bonding cluster tool and FC150 device bonder as strategic investments in their MEMS packaging lab.
Tuesday 27th March 2007
Applied Materials has announced it will hold an opening ceremony for its new Xi¹an China Global Development and Technology Support Centre.
Tuesday 27th March 2007
The news is good but not great for suppliers of NAND-type flash memory, who have been battered by nearly six months of severe price erosion: iSuppli Corp. has upgraded its rating of near-term market conditions.
Tuesday 27th March 2007
SEMI has reported that worldwide sales of semiconductor manufacturing equipment totaled $40.47 billion in 2006, representing a year-over-year increase of 23 percent.
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Tuesday 27th March 2007
Air Liquide Electronics announced the recent commissioning of a new Chemical Mechanical Planarization (CMP) applications and development laboratory near its Dallas, Texas headquarters.
Thursday 22nd March 2007
Axcelis has announced the opening of a new and expanded national headquarters in Shanghai.
Thursday 22nd March 2007
SUSS MicroTec and Surface Technology Systems, two MEMS manufacturing solutions providers, have announced a based roadshow called "MEMS Technology: Embracing the Future,"
Thursday 22nd March 2007
Aviza have announced it received a new order for its Advanced Vertical Processor 200-mm thermal processing system from a leading Chinese semiconductor foundry.
Thursday 22nd March 2007
Applied Materials has been awarded a milestone contract to provide T-Solar Global S.A. of Spain with Europe's first thin film solar module production line using ultra-large 5.7m2 (2.2m x 2.6m) glass panels.
Friday 16th March 2007
UMC has announced plans to open a customer support office in India's Hyderabad Technology Park.
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Friday 16th March 2007
It was a tale of two companies in the semiconductor industry in 2006, with major chip supplier Intel Corp. suffering a revenue decline, while rival Advanced Micro Devices (AMD) nearly doubled its sales, according to iSuppli Corp.¹s final 2006 market-share ranking.
Friday 16th March 2007
North American-based manufacturers of semiconductor equipment posted $1.65 billion in orders in February 2007 (three-month average basis) and a book-to-bill ratio of 1.05 according to the February 2007 Book-to-Bill Report published by SEMI.
Thursday 15th March 2007
Infineon Technologies and Hyundai Motor Company have announced a strategic cooperation for the development of automotive electronics. The companies have also unveiled a joint innovation centre.
Thursday 15th March 2007
On behalf of one India's largest starch companies, the Technology Transfer Centre is seeking partners (SMEs, academic researchers, corporations) for mutually beneficial collaborative projects.
Thursday 15th March 2007
Bede X-ray Metrology is pleased to announce that SEMATECH, will use a Bede X-ray metrology system to evaluate novel semiconductor materials needed for the 45 and 32nm technology nodes and beyond.
Thursday 15th March 2007
IC Insights has released its ranking of the top 25 worldwide semiconductor (ICs and OSDs — optoelectronics, sensors, and discretes) sales leaders for 2006. For the top 25 suppliers, it was clearly a year of the haves versus the have-nots.
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Thursday 15th March 2007
Cenamps, a national centre for emerging technologies, is working with Oxford Instruments to establish a UK open access foundry service, based in the North East of England.
Thursday 15th March 2007
In 2005, a shortfall of 5,000 metric tonnes (MT) of polysilicon used for making solar cells grew to 21,000 in 2006 and will mushroom to 71,000 MT in 2010, according to the report: Opportunities in The Solar Cell Market For Thin Film Technology, recently published by The Information Network.
Thursday 15th March 2007
A recently awarded grant will be invested in the development of atom chip devices which could bring quantum computing closer to reality.
Thursday 15th March 2007
Busak+Shamban operates as the global sales and marketing arm of Trelleborg Sealing Solutions. To consolidate their brand strategy, Busak+Shamban is to change its name to Trelleborg Sealing Solutions, effective from April, 2007.
Wednesday 14th March 2007
Following on the heels of major investments in the purchase of Linweld, and international helium assets from BOC, Matheson Tri-Gas, Inc., announced that its parent company, Taiyo Nippon Sanso Corporation (TNSC), is in the process of making additional investments in the United States.
Wednesday 14th March 2007
NEXX Systems has announced that it has entered into an ongoing joint development program (JDP) with Taiwan Semiconductor Manufacturing Company. (TSMC) of Hsinchu, Taiwan.

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