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Monday 3rd July 2006
Ten manufacturers of thick film microcircuits have come together to form a new alliance that will provide engineers with a central resource of information on how to use this technology and maximise its benefits in custom electronics design.
Monday 3rd July 2006
Data released for May shows reassuring signs for the European market: year-on-year growth on a 3 month average basis has turned slightly positive when measured in dollars and the pace of the growth appears stronger when measured in Euro.
Monday 3rd July 2006
SMSC announced that it has launched a translated version of its website for the China market. Visitors may now access corporate, product and market information in Simplified Chinese through SMSC's Chinese domain.
Monday 3rd July 2006
Research and Markets has announced the addition of Electronic Materials - Global Strategic Business Report to their offering.
Monday 3rd July 2006
Responding to the startling announcement of Intel's cellphone processor division sale to Marvell, the Handset Component Technologies Service of Strategy Analytics has released an analysis of the $600 million Intel-Marvell deal, "Intel Crashes Out of Cell Phone Business. Can Marvel Do Any Better?" This report highlights some of the problems that Intel faced during its seven years in the cellular processor industry, and how these issues could be resolved by new ownership.
Monday 3rd July 2006
Optimal Corporation, and Rio Design Automation Inc. announced the signing of a far-reaching strategic partnership to address the need for chip and package co-design.
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Monday 3rd July 2006
Renesas Technology Corp. announced that it has decided to establish a new building in Ho Chi Minh City to expand its development and design capability for its Vietnam design subsidiary. Renesas Design Viet Nam Co., Ltd. (RVC) With the approval for an increase in capital by the Ho Chi Minh City Export Processing Zone Authority, Renesas will start the construction of the new building once a construction permit is issued. The operations in the new building will begin in September 2007.
Thursday 29th June 2006
Semiconductor Manufacturing International Corporation ("SMIC"), announced that the first 12-inch (or 300mm) fab in Central China began construction in the Wuhan East Lake New Technology Development Zone, Hubei Province, China. The groundbreaking ceremony was attended by Yu Zheng Sheng, Politburo member of Central Committee and Secretary of Hubei provincial party, Luo Qing Quan, Governor of Hubei Province, Chen Yu Jie, Director of the Overseas Chinese Affairs Office of the State Council, Li Hai Feng, Deputy Director of the Overseas Chinese Affairs Office of the State Council and Richard Chang, President and CEO of SMIC.
Thursday 29th June 2006
Freescale Semiconductor has expanded its operations in Bucharest, Romania, with new facilities and a growing staff focused on developing next-generation wireline and wireless communication technologies. The company marked the opening of its new software development centre during an inaugural ceremony attended by Freescale executives, customers and Romanian government officials. ;Freescale's research and development priorities at the software development centre include infrastructure applications for voice/modem/fax over IP (VoIP/MoIP/FoIP), network equipment and infrastructure, software for 3G cellular platforms, ZigBee stack development and integrated development tools (debuggers, compilers and performance analysis tools) for Freescale processors. ;
Thursday 29th June 2006
Amtech Systems, Inc. announced two orders totalling $3 million from the solar cell industry for Tempress brand diffusion furnace systems.
Wednesday 28th June 2006
Marvell Technology Group, Ltd. and Intel Corporation have announced they have signed an agreement for Intel to sell its communications and application processor business to Marvell. The sale will enable Intel to focus its investments on its core businesses, including high-performance, low-power Intel Architecture-based processors and emerging technologies for mobile computing, including Wi-Fi and WiMAX broadband wireless technologies.
Wednesday 28th June 2006
Recent results for Infineon demonstrates continued European strength in the automotive electronics industry. According to the latest study from US market research company Strategy Analytics the sales growth of 11.9 % posted by Infineon’s automotive electronics business in 2005 means that it has once again significantly outperformed the global market as a whole, which expanded by 7.5 % to US $16.4 billion.
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Wednesday 28th June 2006
Recent results for Infineon demonstrates continued European strength in the automotive electronics industry. According to the latest study from US market research company Strategy Analytics the sales growth of 11.9 % posted by Infineon's automotive electronics business in 2005 means that it has once again significantly outperformed the global market as a whole, which expanded by 7.5 % to US $16.4 billion.
Wednesday 28th June 2006
JAM Technologies Inc. announced partnerships with four world-class semiconductor sales distributors in Asia. Newly established relationships with Internix in Japan, Adnet in Korea, Metatech in Singapore and CoreValue in Hong Kong/China, bolster the company's sales force with proven expertise in the consumer electronics semiconductor industry.
Wednesday 28th June 2006
Veeco Instruments Inc. and Korea Photonics Technology Institute (KOPTI) announced they have entered into a collaborative relationship for the advancement of solid state lighting.
Wednesday 28th June 2006
Veeco Instruments Inc. and Korea Photonics Technology Institute (KOPTI) announced they have entered into a collaborative relationship for the advancement of solid state lighting.
Wednesday 28th June 2006
TriQuint Semiconductor, Inc. announced the intent to open a new design and support centre in High Point, North Carolina. The facility will be known as the North Carolina Design Centre (NCDC), and is part of TriQuint's ongoing program to work more closely with strategic partners and customers in the development of next-generation wireless modules and components.
Wednesday 28th June 2006
The Bosch Group is investing some 550 million euros in the construction of a new manufacturing facility for 200 millimetre (eight-inch) semiconductors at its site in Reutlingen, near Stuttgart. Construction of the facility is to begin in the autumn of 2007. Rollout of production is planned for mid-2009. The plant will have a total capacity of up to 1,000 silicon wafers per day, equivalent to a daily production volume of up to one million microchips. "In investing heavily in state-of-the-art manufacturing technology, we are securing the long-term future of our international automotive electronics business," said Franz Fehrenbach, chairman of the Bosch Board of Management. Bosch has been manufacturing 150-millimeter (six-inch) semiconductors in Reutlingen for ten years now. The location can therefore draw on a wealth of expertise and has a good infrastructure.
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Wednesday 28th June 2006
Philips Lumileds Lighting Company announced that it has established new luminance performance records for solid-state lighting technology at 1 Amp.
Tuesday 27th June 2006
NANOIDENT Technologies AG, announced the launch of a new division -- NANOIDENT Biometrics GmbH. The company also announced that this division will be led by Managing Director, Alain Jutant, who brings a deep expertise in biometrics and image sensors to the company.
Tuesday 27th June 2006
Cree, Inc., announced it has signed a agreement to acquire privately held INTRINSIC Semiconductor Corporation.
Tuesday 27th June 2006
SEMI has published eight new technical standards applicable to the semiconductor, flat panel display (FPD) and MEMS manufacturing industries. The new standards, were developed by technical experts from equipment suppliers, device manufacturers and other companies participating in the SEMI International Standards Program.
Monday 26th June 2006
Plans for Advanced Micro Devices Inc (AMD) to build a new $3.2 billion microprocessor factory in New York will work towards facilitating expansion against rival competitor Intel Corp.
Monday 26th June 2006
Future Horizons plots solid growth for European fabless and IC design, recently published in the 2006 edition of its European Chipless & Fabless Design House Report covering independent IC design companies in Western Europe and Israel

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