European company POWERLASE, manufacturer of powerful nanosecond Q-switched, diode-pumped solid state (DPSS) lasers, has announced the purchase of its innovative Starlase lasers by the Extreme Ultraviolet Lithography System Development Association (EUVA). The lasers will be used to further the research and development specialist's findings in the field of extreme ultraviolet (EUV) sources.
Samsung announced this week that it has completed the first working prototype of a Phase-change Random Access Memory (PRAM) that Samsung believes will replace high density NOR flash within the next decade.
Magma Design Automation Inc announced it has donated specifications for its low-power technology to Accellera, an EDA industry standards organization, as part of Accellera's low-power standardization effort.
Synopsys, Inc. and Nikon Corporation announced that they are collaborating on the development and delivery of advanced lithography software models and DFM enabled lithography manufacturing solutions for 45 nm and below.
Ponte Solutions, Inc. announced a technology partnership with leading global semiconductor manufacturer UMC to establish design-stage yield analysis that enables pre-tapeout yield enhancement for 90nm and below technologies.
According to a report by the Information Network that although there are several potential lithography techniques at the 32nm node, it is becoming increasing clear that 193nm immersion will be the most likely candidate for manufacturing IC devices at the 32nm node. The report suggests Nikon will take over leadership in this arena despite current figures.
AMD has been revealing details of its technology roadmap, specifically what lies ahead with quad-core computing.
Scheduled to appear in the first half of 2007 - first for servers, but then rolled out across AMD desktop and laptop offerings - this will be the next step for AMD multi-core processing.
BASF has announced that it is going to expand its annual capacity for manufacturing the special amines aminodiglycol (ADG) and morpholine, from the current 20,000 metric tons to 30,000 metric tons, at its German ;Verbund site in Ludwigshafen
ASML Holding (ASML) announced that semiconductor R&D consortium SEMATECH has awarded ASML a contract to qualify the imaging performance of advanced logic patterns, metrology structures and defect designs for the 45-nanometer (nm), 32-nm, and 22-nm technology nodes.
Mentor Graphics Corporation announced that Semiconductor Company, Matsushita Electric Industrial Co., Ltd. has selected the Calibre OPCverify tool for use in production at 65 nanometers (nm) and below.
Magma Design Automation Inc. announced that the withdrawal by Synopsys Inc. of two patents at issue in the lawsuit it filed is a "transparent, desperate attempt" to mask the misdeeds Synopsys committed when it submitted fraudulent patent applications and then attempted to enforce those fraudulently obtained patents against Magma.