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Wednesday 19th July 2006
e2v technologies plc (“e2v”, the “Company” or the “Group”), announced that its subsidiary, e2v technologies S.A.S., has conditionally agreed to acquire Atmel Grenoble S.A.S. (“Atmel Grenoble”) for a total consideration of US$140 million (approximately £76 million) in cash subject to a post-completion adjustment based upon the level of net working capital in Atmel Grenoble at completion (the “Acquisition”).
Wednesday 19th July 2006
Carl Zeiss SMT has acquired 100% of the shares of ALIS Corporation, Peabody, USA for its Nano Technology Systems Division (NTS). ALIS´ newly developed helium ion microscopy technology will add an important building block to Carl Zeiss SMT´s existing portfolio of charged-particle technologies aimed at nano-scale imaging, structuring and analysis applications. ;;
Tuesday 18th July 2006
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Tuesday 18th July 2006
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Tuesday 18th July 2006
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Tuesday 18th July 2006
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Tuesday 18th July 2006
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Tuesday 18th July 2006
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Tuesday 18th July 2006
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Tuesday 18th July 2006
Soitec announced consolidated sales of 85.7 million Euros for the first quarter of its financial year 2006-2007, which represents a year-on-year growth of 67.1% and is consistent with the company's existing guidance. Sales for the quarter set another record level, again illustrating the continuing adoption of SOI by the semiconductor industry. SOI wafer sales recorded sequential growth of 10.8% in total and 14.5% at constant exchange rates.
Tuesday 18th July 2006
KLA-Tencor Corporation and ADE Corporation announced that the acquisition of ADE will be delayed pending approval from German antitrust authorities. The acquisition has already been cleared by the antitrust authorities in the United States and in all other applicable jurisdictions.
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Tuesday 18th July 2006
Aviza Technology, Inc announced that a leading Taiwanese foundry has placed an order for Aviza's next-generation single wafer atomic layer deposition (ALD) system, Celsior.
Monday 17th July 2006
Semiconductor Research Corporation (SRC), announced the launch of the Non-Classical CMOS Research Centre. With more than US$7 million of funding spread across three years, five universities will collaborate as one research centre to develop and exploit a new class of semiconductor materials, stretching silicon to its ultimate performance as CMOS.
Monday 17th July 2006
The Fab Owners Association (FOA), the association of semiconductor manufacturing executives and suppliers, has announced that Freescale Semiconductor has joined the organization as a voting member. CIMAC, Inc. ; AVIZA Technology Inc. ; Tara Technology Inc and Colliers International - Advanced Technology Real Estate Group have also joined as associate members.
Monday 17th July 2006
AMI Semiconductor, Inc. announced that it successfully completed its acquisition of certain assets of Starkey Laboratories, Inc.'s (Starkey) integrated circuit design centre for approximately $6 million in cash.
Monday 17th July 2006
AMD announced that in June it began its first revenue shipments of AMD64 processors manufactured at Chartered Semiconductor Manufacturing in Singapore. AMD and Chartered ramped 300mm production at Fab 7 in record time, hitting all major milestones and starting production at mature yields. Initial shipments out of Chartered consisted of microprocessors manufactured on 90nm process technology. The ramp of volume production at Chartered combined with recent announcements in Dresden shows that AMD will have the ability to intelligently scale and flex production in line with customer demand.
Monday 17th July 2006
Samsung Electronics Co., Ltd will jointly construct and operate a 300 mm wafer fab. The JV, dubbed Siltronic Samsung Wafer Pte. Ltd., supports the growing market demand as the industry-wide shift to 300 mm fabrication rapidly increases.
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Monday 17th July 2006
AIXTRON AG has received their first order for its 300 mm silicon CVD LYNX3 system, which will be installed in a recently built memory fab located in Jiangsu Province, P.R. China.
Monday 17th July 2006
Sofinnova Partners has led a €10.6 million financing in Accent, the STMicroelectronics and Cadence Design Systems joint venture company, and a global provider of microelectronics product design and realisation services as well as semiconductor IP licensing.
Friday 7th July 2006
Soitec (Euronext Paris) unveiled its new expansion development strategy aimed at addressing the growing worldwide demand for SOI and other engineered substrates. To this end, the company reports it is expanding its existing production capacity base in France, while also augmenting its global industrial presence with a new production plant based in Singapore.
Friday 7th July 2006
CMC Interconnect Technologies, continue to expand their capabilities for Ceramic Substrate, Module and Package Rework. With focus on complex and high dollar value ceramic products, "rework is the refurbishing of material " for reuse in production. Reworked ceramic substrates will meet the same quality standards and product reliability specifications as new incoming substrates, with a significantly lower material cost.
Friday 7th July 2006
SUSS MicroTec announced that AZ Electronic Materials USA Corp has purchased a resist qualification modular cluster from SUSS MicroTec. It will be used to optimise the coat, bake, and develop performance of AZ's existing thin and thick resists, as well as for the evaluation of newly developed materials.
Friday 7th July 2006
MEMSCAP (Euronext: MEMS) announces it has signed an agreement of sale of its Bernin manufacturing plant.The Company has concluded with SOITEC (Euronext : SOI) an agreement of sale of its Bernin manufacturing site for a net amount of 13 million euros, which includes the transfer of the existing site lease-back agreement. This sale would totally annul MEMSCAP financial liabilities (with a net cash over 10 million euros) and would enable the Company to increase its cash by more than 7 million.

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