Info
Info
News search:

< Page of 403 >

News


Thursday 26th January 2006
The Royal Society report, The long-term management of radioactive waste: the work of the Committee on Radioactive Waste Management, recommends that scientific and technical organisations should be involved with the exercise to assess the "weight" that should be given to different criteria being applied to CoRWM's short list of options for the disposal of radioactive waste
Thursday 26th January 2006
The Project on Emerging Nanotechnologies at the Woodrow Wilson International Centre for Scholars announced the release of a report by one of the country’s foremost authorities on environmental research and policy. Examining the strengths and weaknesses of the current regulatory framework for nanotechnology calling for a new approach to nanotechnology oversight.
Thursday 26th January 2006
Macrotron Scientific Engineering GmbH (MSE) announced the expansion of its Frontend division by offering thermal processing systems. MSE expand its Frontend division for semiconductor manufacturing and now offers a solution for rapid thermal processing (RTP) to the semiconductor industry.
Thursday 26th January 2006
Sense Holdings, Inca developer of next-generation biometric and explosive detection security technologies for government and commercial security markets, announced an important recent progress report under a research and development project with the U.S. government's Oak Ridge National Laboratory to develop a new line of handheld multipurpose explosive and chemical detection device products for the global homeland security marketplace.
Thursday 26th January 2006
Texas Instruments (TI) Incorporated announced it has finalised its previously announced acquisition of Chipcon, a leading company in the design of short-range, low-power wireless RF (radio frequency) transceiver devices. This acquisition will expand TI's high-performance analogue portfolio and will enable TI to provide customers with industry-leading ZigBee compliant solutions and a broad range of proprietary radio frequency integrated circuits that enable innovative low-power wireless applications.
Friday 20th January 2006
Infineon Technologies AG celebrated the official opening of its newest development centre in the Romanian capital Bucharest.
Info
Thursday 19th January 2006
Swiss-based company Alphasem’s has delivered news of its new Application & Training Center located in the industrial district of Penang.
Wednesday 18th January 2006
Fujitsu Limited announced that it will construct a new fab to mass-produce logic semiconductors employing leading-edge 65-nanometer (nm) process technology and 300 millimetre (mm) wafers.
Tuesday 17th January 2006
New figures published in a report by Soitec deliver good news all round for the SOI wafer market. Indicated by a 120% year on year sales growth.
Monday 16th January 2006
ASML announced a good outlook for 2006 in its 2005 annual and fourth quarter earnings results.
Sunday 15th January 2006
A recent fourth quarter report compiled by Intel shows sales are down, indicated by a revenue review below the company’s updated expectations of $10.4 billion to $10.6 billion.
Saturday 14th January 2006
IMEC announced the extension of its Europractice IC Service with the offering of UMC’s 90nm process technology.
Info
Friday 13th January 2006
Following a flat 2005, VLSI Research predicts a positive outlook for the semiconductor industry in 2006. IC revenues are expected to increase 8%, while equipment for ICs and flat-panel displays should grow 6% over 2005.
Thursday 12th January 2006
The Centre for Integrated Photonics has developed a reflective semiconductor optical amplifier offering highly optimised performance for WDM passive optical network (PON) applications.
Wednesday 11th January 2006
Bede X-ray Metrology, a global provider of X-ray metrology systems to the semiconductor industry, is pleased to announce that a major Asian semiconductor manufacturer has selected the BedeMetrix-F system for metrology on their leading-edge 65nm process.
Tuesday 10th January 2006
ASM International N.V. announced that it has sold a 300 mm epitaxial reactor into Mainland China.
Monday 9th January 2006
Synova, pioneer of water jet-guided laser technology, announced the successful resolution of its patent infringement lawsuit against the bankruptcy estate of Prejet Prazisionstechnik AG, involving the company's one-time construction of prototype laser cutting machines.
Sunday 8th January 2006
Avago Technologies has announced it has now started operations as a privately held independent semiconductor company.
Info
Saturday 7th January 2006
Sela announced it has received an order from TOK America for its sample preparation equipment for a “tool matching” application.
Friday 6th January 2006
STMicroelectronics announced its role in a new European Integrated Project called CLEAN (Controlling Leakage power in NanoCMOS SoCs).
Friday 6th January 2006
Total revenues in the European pressure sensors and transmitters markets stood at US$1,484.8 million in 2005 and are set to reach US$2,069.6 million by 2012, according to market researchers at Frost & Sullivan.
Friday 6th January 2006
“MEMS technology driven by automotive, information technology and telecommunication applications has successfully matured from lab to fab,” says Mr. Thallner (CEO and founder of EVG).
Friday 6th January 2006
A US$700,000 grant awarded to the University of Massachusetts Amherst by the US National Science Foundation will fund a Nano-Imprint Lithography laboratory to further research capabilities in nanoscale device manufacturing. Delivery and installation of the new equipment is expected by spring 2006.
Friday 6th January 2006
Oxford nanoScience reports that developers of MRAM (magnetoresistive random access memory) in the Far East are taking a keen interest in the company’s Laser 3 Dimensional Atom Probe (3DAP) from to provide an accurate analysis method to show the atomic level structure in these complex devices.

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info