Practical Vacuum incorporating Semiconductor Processing 15th & 16th February 2006 ‘The definitive event for the Vacuum Industry'Since its launch in 1999 Practical Vacuum and Semiconductor Processing, has become the ‘must-see’ event for all aspects of vacuum technology and semiconductor processing. The event is acknowledged as the place to find all that's new and emerging in the vacuum and semiconductor processing industries and consistently attracts a high calibre audience wishing to buy or specify products and services. "Excellent show – met potential customers we were not aware of." - NTE Vacuum Technology Ltd speaking about the 2005 Practical Vacuum event. Around 70% of visitors who responded when asked said they were visiting Practical Vacuum 2005 to source new products or suppliers. Of these a staggering 96% were successful in finding products or services to satisfy the needs of either a bespoke application or had managed to source a complete 'off-the-shelf' package Practical Vacuum and Semiconductor Processing visitors will come from these industry specific disciplines: • Aerospace • Automotive • CD/TV • Chemicals • Electronics • Food • Government or Research Council • Instruments • Manufacturing • Materials • Packaging • Pharmaceuticals • Power/Utilities • Print • Telecommunications Practical Vacuum will once again be co-located with eight shared interest events at the NEC Birmingham, including Machine Building and Automation, PneuMotion – Air at Work, Imaging Photonics and Optical Technology, Machine Vision, Displays Technology, Mtec sensors, measurement and instrumentation, and Drives & Motion Control Systems For more latest stand availability or information on visiting Practical Vacuum or any of the other exhibitions please tel 01822 614671, email email@example.com or visit http://www.practicalvacuum.co.uk, where you can also pre-register to attend.
With industry driven programmes such as JESSI, MEDEA and MEDEA+, Europe’s capabilities in micro-/nanoelectronics R&D have been built up and Europe successfully managed to become a world player in a fierce competition capturing innovative domains. MEDEA+ being one of Europe’s key-enablers for innnovation and thereby for economic growth and employment, and ending in 2008 starts thinking about its future role and perception.
IC Insights has released its 2005 forecast of the worldwide top 20 semiconductor suppliers (Figure 1). All companies in the top 20 ranking are forecast to have semiconductor sales of at least $3 billion, about the same dollar amount needed to construct a high-volume 300mm wafer fabrication facility.
Micron Technology and Intel Corporation have announced they have agreed to form a new company to manufacture NAND flash memory for use in consumer electronics, removable storage and handheld communications devices. The new company will exclusively manufacture product for Micron and Intel. Formation of the company is subject to customary closing conditions and is expected to be finalized around the end of the year.
Forecasts of quarterly revenues and gross margins are proving more accurate than company guidance in many cases, now being offered publicly by Advanced Forecasting, for the Silicon Cycle. Due to its quantitative non-survey methodology, the firm's reports are used to counterbalance company guidance and other estimates.
Silecs has announced the expansion of its electronic chemicals production capacity to several metric tons per month by adding new high purity production lines in Espoo, Finland. Silecs has a focus on advanced dielectrics for semiconductor manufacturing.
Patents for licensing are a company’s defence to safeguard their product. But in a competitive market rivals will instinctively aim to equal or challenge innovation. Testifying claims against competitors who infringe upon the boundaries of patented products can prove to be an epic battle as recently experienced by Corning, U.S. based Technology Company
SUSS MicroTec has Announced Purdue University has purchased a SUSS Substrate Bonder and a MMask / Bond Aligner for use in Purdue's new Birck Nanotechnology Centre. Purdue University is recognized as one of the top 5 universities for the advancement of "Nano Education".
The MEMS development of an American subsidiary of German based Siemens AG has been voted among the year’s best technologies by a prestigious North American technical magazine. In a sign that the MEMS market is rapidly developing new market potential, the work on environmental usage of MEMS by Siemens has been singled out.
Integral Vision, Inc. has announced financial results for its fiscal third quarter ending September 30, 2005. Revenues for the quarter were $14,000 and the net loss for the company was $780,000 or $0.03 per share.
World wide silicon wafer area shipments increased 9% during the third quarter 2005 when compared to the second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
Since its commercial inception in 1987 Electrodeionization (CEDI) technology has been subject to continual update and development for new models. Drawing on industry knowledge and individual technological expertise manufacturers have been faced with the challenge of developing the CEDI module design in power applications.
The markets for nano materials, tools and equipment for nanoelectronics totalled US$1,827 million in 2005 and are forecasted to reach $4,219 million by the year 2010, according to Global Nanoelectronics Markets and Opportunities, report from SEMI.
The United States, Japan and Switzerland are putting pressure on China to bolster its intellectual property protection rules, amidst accusations of mass counterfeiting in the world’s most populous nation.
Attracted by the strong sales growth for diminutive active-matrix displays, South Korean suppliers are mounting an aggressive assault on the market for small/medium TFT-LCD panels, challenging the Japanese firms that now dominate this market segments.
Major US chip makers AMD and IBM has broadened the scope of their technology alliance. The expanded alliance now includes early exploratory research of new transistor, interconnect, lithography, and die-to-package connection technologies through to 2011.