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Friday 12th November 2004
Japanese electronics giant Toshiba has filed suits against Hynix Semiconductor – the world's largest DRAM producer - in Japan and the US, alleging infringement of its semiconductor memory patents.
Thursday 11th November 2004
German company Boin has shipped a site licence for its WAFERMAP 2.3 professional software to Mattson Thermal Products to allow for an unlimited number of users at one location.
Thursday 11th November 2004
IntelÕs board of directors has elected Paul S Otellini, currently president and chief operating officer (COO), as its next CEO. Otellini will succeed Craig R Barrett. Barrett will succeed Andrew S Grove as chairman of the Intel board of directors.
Thursday 11th November 2004
BE Semiconductor Industries (Besi) and Datacon Technology will merge to form a leading global advanced IC packaging system supplier. Besi will take over all of Datacon's shares, in return for which shareholders will receive 90% cash as well as shares. The purchase price in euros was just below the three-figure millions - including net financial liabilities. The negotiations with Besi are in the final stages. The merger is likely to take place in January next year, once all antitrust and other formal matters have been clarified.
Thursday 11th November 2004
Researchers from Aachen will be awarded GermanyÕs Stifterverband (Donors Association for the Promotion of Humanities and Science) Science Prize for contributions to extreme ultraviolet (EUV) lithography. The technologists come from Fraunhofer ILT, the department of laser technology at the RWTH Aachen and two industrial companies, AIXUV and Philips Extreme UV. The prize will be awarded at the Fraunhofer-Gesellschaft organisationÕs annual general assembly and is made in recognition of close and fruitful co-operation between research and industry.
Thursday 11th November 2004
X-FAB Semiconductor Foundries has a new, patented positive intrinsic negative (PIN) diode module for its 0.6micron BiCMOS technology (XB06). The company says that this is the first time that it has been possible to integrate PIN diodes with CMOS and BiCMOS transistors on a single chip. The parameters of standard XB06 transistors are not influenced by the PIN diode integration.
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Thursday 11th November 2004
Researchers in the United States have used nanotechnology to create a miniaturised version of a vital piece of medical equipment, bringing a step closer the Star Trekian vision of a hospital in a box.
Wednesday 10th November 2004
BOC Edwards is building seven gas plant facilities to ensure bulk gas supply to nine new semiconductor and flat panel display fabs. The gas supply schemes, paving the way for these multiple supply contracts, are being developed as part of a $75mn investment with BOC's long-term joint venture partner, BOC Lienhwa Industrial Gases (BOCLH).
Wednesday 10th November 2004
FSI International reports that "a leading European IC manufacturer" has purchased multiple ANTARES CX CryoKinetic cleaning systems after a successful demonstration of defect removal in an on-site evaluation program. The systems will be used on advanced devices for both front-end-of-line (FEOL) and back-end-of-line (BEOL) defect removal on planar and surface patterned structures.
Wednesday 10th November 2004
ASML announced details of a fourth customer in the tough Japanese market. Matsushita Electric Industrial (MEI) has ordered ASMLÕs TWINSCAN lithography system for 300mm production. MEI manufactures consumer products under the Panasonic brand. The sale marks a milestone in ASML's expansion within the Japanese market, which traditionally has been dominated by local lithography companies, namely Nikon and Canon.
Wednesday 10th November 2004
OSRAM Opto Semiconductors has developed new packaging technology for use in its infrared (IR) emitter diodes and detectors. The Molded Interconnect Device Light Emitting Diodes (MIDLEDs) surface-mount technology (SMT) devices have a construction that offers electrical contact pads on both the bottom and side of the package. This enables the same part to be either used as a top-facing (Z axis) or side-facing (X axis) solution, providing greater design flexibility.
Wednesday 10th November 2004
STMicroelectronics claims a first with its introduction of a Megapixel mobile-camera chipset compliant with the Standard Mobile Imaging Architecture (SMIA). The new mobile-camera kit consists of a camera module (VS6650) and mobile imaging processor (STV0976). ST and Nokia released the SMIA spec in July 2004.
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Wednesday 10th November 2004
The bitter dispute between Infineon Technologies and ProMOS Technologies has ended with agreement regarding ProMOS' license of Infineon's DRAM technologies transferred to ProMOS.
Wednesday 10th November 2004
Researchers from Cornell University, USA have built a microscopic device using silicon that can detect viruses in minuscule amounts.
Wednesday 10th November 2004
Japanese paper maker Oji Paper Ð in association with FEC Group and Toppan Forms Ð has developed technology to embed semiconductor chips in paper.
Wednesday 10th November 2004
The current downturn in the semiconductors equipment market is likely to be "longer" and "more severe" than has previously been estimated, claims Goldman Sachs Global Investment Research.
Wednesday 10th November 2004
The current downturn in the semiconductors equipment market is likely to be "longer" and "more severe" than has previously been estimated, claims Goldman Sachs Global Investment Research.
Wednesday 10th November 2004
Only 69% of contract electronics manufacturers believe they will be fully compliant with European Union (EU) environmental legislation by the July 2006 deadline prescribed by the Restriction of Hazardous Substances (RoHS) directives, according to research by Technology Forecasters (TFI) and components distributor Avnet Electronics Marketing.
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Wednesday 10th November 2004
The bitter dispute between Infineon Technologies and ProMOS Technologies has ended with agreement regarding ProMOS' license of Infineon's DRAM technologies transferred to ProMOS.
Wednesday 10th November 2004
STMicroelectronics claims a first with its introduction of a Megapixel mobile-camera chipset compliant with the Standard Mobile Imaging Architecture (SMIA). The new mobile-camera kit consists of a camera module (VS6650) and mobile imaging processor (STV0976). ST and Nokia released the SMIA spec in July 2004.
Wednesday 10th November 2004
A team of scientists from Philips and the Kavli Institute of Nanoscience Delft claims the world first growth of III-V semiconductor nanowires on germanium and silicon substrates (Nature Materials, November 2004).
Wednesday 10th November 2004
OmniVision Technologies claims a world first with a 5Mpixel CMOS image sensor, promising lower costs for high-end products.
Wednesday 10th November 2004
Researchers from Cornell University, USA have built a microscopic device using silicon that can detect viruses in minuscule amounts.
Wednesday 10th November 2004
AMD and Chartered Semiconductor Manufacturing have entered into sourcing and manufacturing technology agreements. Chartered will implement under license portions of AMD's Automated Precision Manufacturing (APM) advanced process control (APC) software suite and become an additional manufacturing source of AMD64 microprocessors.

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