The market for radio frequency identification (RFID) chips – which are set to be incorporated into the next generation of payment cards, price labels and product identification tags – is set to grow rapidly over the next five years, according to market researcher In-Stat.
Semiconductor equipment giant Applied Materials and Belgiumbased nanotechnology research centre IMEC have launched a joint initiative to develop 45nmgeneration transistor-level semiconductor processing technologies.
US semiconductor giant Texas Instruments has unveiled plans to develop radio frequency identification (RFID) chips for use in international payment card company MasterCard’s next generation of payment cards and tokens.
Semiconductor equipment giant Applied Materials and Belgium-based nanotechnology research centre IMEC have launched a joint initiative to develop 45nm-generation transistor-level semiconductor processing technologies.
German chip maker Infineon Technologies AG has announced that it expects revenues and earnings before interest and taxes (EBIT) in the first quarter of fiscal year 2005 to be below market expectations.
South Korean chaebol Samsung Electronics has announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high-capacity mobile devices such as 3G handsets.
Geneva-based chip maker STMicroelectronics and Atlanta-based set-top box company Scientific-Atlanta have announced that they are in full production with a jointly developed integrated cable set-top box chip.
German chipmaker Infineon Technologies is part of an IBM-led consortium of semiconductor giants that have pledged to invest US$2.5 billion in an advanced semiconductor plant and research centre in New York.