South Korean chaebol Samsung Electronics has announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high-capacity mobile devices such as 3G handsets.
German chipmaker Infineon Technologies is part of an IBM-led consortium of semiconductor giants that have pledged to invest US$2.5 billion in an advanced semiconductor plant and research centre in New York.
Chipmaking giant Infineon and interconnect manufacturer Parlex Corporation have announced plans to set up a joint venture to produce advanced substrates for secure mobile electronic identification products.
Foundry giant Chartered Semiconductor Manufacturing has secured a US$653 million term loan facility from JP Morgan to fund the first phase ramp of Fab 7 in Singapore, the company's first 300mm wafer fabrication facility.
French company Soitec has announced that it will supply silicon-on-chip (SOI) substrates for a major initiative aimed at developing multigate field effect transistor (MuGFET)technology for the 45nm node and below.
Dutchlithograp hy giant ASML has signed an agreement with Swedish firm Micronic Laser Systems AB that gives ASML the right to market optical maskless lithography for semiconductor applications based on Micronic's patented spatial light modulator (SLM)technology.