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Wednesday 19th January 2005
Dutch lithography equipment giant ASML has reported impressive financial results for the fourth quarter of 2004, making net profits of euro 109 million on net sales of euro 785 million. However, concerns have been raised over the state of the company's order book, which shrunk significantly compared with the previous quarter.
Wednesday 19th January 2005
Affected workers will be offered retraining according to a leaked memo from CEO Mike Splinter
Wednesday 19th January 2005
German chip maker Infineon Technologies AG has announced that it expects revenues and earnings before interest and taxes (EBIT) in the first quarter of fiscal year 2005 to be below market expectations.
Wednesday 19th January 2005
The world’s leading chip maker – Intel – has unveiled plans for a major revamp of its operations ahead of the appointment of a new chief executive officer to replace veteran Craig Barrett.
Wednesday 19th January 2005
The anticipated semiconductor slowdown in 2005 will last longer than expected, according to a worrying new forecast from market analyst Semico.
Wednesday 19th January 2005
The market for radio frequency identification (RFID) chips – which are set to be incorporated into the next generation of payment cards, price labels and product identification tags – is set to grow rapidly over the next five years, according to market researcher In-Stat.
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Wednesday 19th January 2005
Semiconductor equipment giant Applied Materials and Belgiumbased nanotechnology research centre IMEC have launched a joint initiative to develop 45nmgeneration transistor-level semiconductor processing technologies.
Wednesday 19th January 2005
Further evidence has emerged suggesting that the widely anticpated slowdown in 2005 is going to be less severe than previously expected.
Wednesday 19th January 2005
Dr Ben Tsai has joined Japanese semiconductor giant Tokyo Electron (TEL) as senior executive officer for technology.
Wednesday 19th January 2005
French silicon wafer manufacturer Soitec has clinched a contract for the longterm supply of silicon-oninsulator wafers to chip maker Advanced Micro Devices (AMD).
Wednesday 19th January 2005
US semiconductor giant Texas Instruments has unveiled plans to develop radio frequency identification (RFID) chips for use in international payment card company MasterCard’s next generation of payment cards and tokens.
Wednesday 19th January 2005
Financial watchdog NASD has fined a research analyst US$75,000 for circulating a false rumour about RF Micro Devices – a manufacturer of radio frequency integrated circuits - in August 2002.
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Wednesday 19th January 2005
French silicon substrate manufacturer Soitec has reported sales of euro 31.9 million for the third quarter of its 2004-2005 financial year.
Monday 17th January 2005
French silicon wafer manufacturer Soitec has clinched a contract for the longterm supply of silicon-on-insulator wafers to chip maker Advanced Micro Devices (AMD).
Friday 14th January 2005
Applied Materials - the leading player in the semiconductor equipment market - is planning to cut 240 positions, according to a leaked memo from the company's chief executive Mike Splinter.
Thursday 13th January 2005
Semiconductor equipment giant Applied Materials and Belgium-based nanotechnology research centre IMEC have launched a joint initiative to develop 45nm-generation transistor-level semiconductor processing technologies.
Wednesday 12th January 2005
German chip maker Infineon Technologies AG has announced that it expects revenues and earnings before interest and taxes (EBIT) in the first quarter of fiscal year 2005 to be below market expectations.
Wednesday 12th January 2005
The company cites “significant delay and high uncertainty of closing” as reasons for decision.
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Wednesday 12th January 2005
California-based Intel, the world’s largest computer chip maker, has reported record quarterly and annual sales.
Wednesday 12th January 2005
Pan-European semiconductor research group MEDEA+ has set up an advisory board on maskless lithography with the aim of providing guidance to the various European initiatives on maskless lithography.
Wednesday 12th January 2005
South Korean chaebol Samsung Electronics has announced that it has developed the world's first eight-die multi-chip package (MCP) technology, designed for use in high-capacity mobile devices such as 3G handsets.
Wednesday 12th January 2005
Geneva-based chip maker STMicroelectronics and Atlanta-based set-top box company Scientific-Atlanta have announced that they are in full production with a jointly developed integrated cable set-top box chip.
Wednesday 12th January 2005
The semiconductor equipment industry had its best year since 2000 in 2004, sales leaping by 52.5% to US$51 billion, according to new figures from market analyst VLSI Research.
Wednesday 12th January 2005
California-based system-on-chip interconnect supplier Sonics Inc has opened an engineering design centre in Armenia as part of ambitious plans to grow the company.

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