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Friday 15th October 2004
Trikon Technologies has shipped its Sigma fxP metal deposition equipment to CEA Leti (Laboratoire d'Electronique de Technologie de l'Information) in Grenoble, France. The system will be used for the research and development of bulk acoustic wave (BAW) resonators, a signal filter technology used in cell phones, Bluetooth and WLAN systems.
Friday 15th October 2004
The Royal Society of Edinburgh's 2004 Gannochy Trust Innovation award has been given to Dr Ian Underwood, co-founder of MicroEmissive Displays (MED).
Friday 15th October 2004
Speed-ups look set to be a thing of the past at Intel. Reports (e.g. Financial Times, October 15, 2004) suggest that the semiconductor leader has abandoned plans to introduce a 4GHz Pentium.
Friday 15th October 2004
Freescale Semiconductor, Motorola's semiconductor spin-off, and TSMC have signed an agreement to jointly develop a new generation of silicon-on-insulator (SOI) high-performance transistor front-end technology targeted for the 65nm CMOS process node.
Friday 15th October 2004
EV Group and Datacon Technology have agreed joint development of advanced-chip-to-wafer (AC2W) technology.
Friday 15th October 2004
The European Commission (EC) has decided to formally ask France, the Netherlands, Finland and Sweden for information on certain invitations to tender launched by authorities in those countries for the supply of computer equipment.
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Friday 15th October 2004
The Royal Society of Edinburgh's 2004 Gannochy Trust Innovation award has been given to Dr Ian Underwood, co-founder of MicroEmissive Displays (MED).
Friday 15th October 2004
Chip manufacturer Philips, research institution RWTH Aachen and equipment supplier AIXTRON signed a collaboration agreement aiming at the joint development of large-area white organic light emitting diodes (OLED).
Friday 15th October 2004
ASM International has entered into an agreement with Europe's IMEC research centre to deliver a full suite of 300mm front-end-of-the-line (FEOL) semiconductor wafer processing equipment and to participate in several of IMEC's research programs as a strategic partner.
Friday 15th October 2004
BOC Edwards has purchased a 50% ownership in Taiwanese Asia Union Electronic Chemical (AUECC) from UPC Technology (UPC).
Friday 15th October 2004
Infineon Technologies and Finisar have agreed to reduce the number of shares needed for Finisar is to acquire Infineon's Fibre Optics business unit based in Berlin, Germany.
Friday 15th October 2004
FlipChip International has opened a Reliability & Design centre for wafer level packaging (WLP) and flip chip bumping technologies at its facility in Phoenix, Arizona.
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Friday 15th October 2004
Trikon Technologies has shipped its Sigma fxP metal deposition equipment to CEA Leti (Laboratoire d'Electronique de Technologie de l'Information) in Grenoble, France.
Friday 15th October 2004
International Rectifier's Newport, Wales, facility has earned a UK energy efficiency award from the National Microelectronics Institute (NMI) trade group.
Friday 15th October 2004
IDC estimates that the enterprise storage semiconductor market will pass $1bn in 2005, an 18.5% increase on 2004's forecasted $857mn.
Friday 15th October 2004
AMD and Fujitsu's Spansion joint Flash memory subsidiary reports that its Fab 25 flagship manufacturing plant in Austin, Texas, is now fully dedicated to producing 110nm floating gate Flash memory products for wireless and other markets.
Friday 15th October 2004
Oki has developed a hybrid heat radiation material that reduces 30% of intense heat generated by electronic equipment.
Friday 15th October 2004
OSRAM Opto Semiconductors is applying its thin-film technology to infrared (IR) emitter diodes.
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Friday 15th October 2004
Philips Semiconductors reports Q3 sales of EUR1.388bn, a nominal increase of 11% (comparable 14%) on Q3 2003.
Friday 15th October 2004
Novellus is to pay Semitool $2.9mn under a settlement of patent litigation in the US Oregon district court.
Thursday 14th October 2004
ASM International has entered into an agreement with Europe's IMEC research centre to deliver a full suite of 300mm front-end-of-the-line (FEOL) semiconductor wafer processing equipment and to participate in several of IMEC's research programs as a strategic partner. The equipment is to be delivered in Q4 2004 and 2005. The strategic partnership includes participation for three years in IMEC's 300mm, sub-45nm related technology development programs.
Thursday 14th October 2004
EV Group and Datacon Technology have agreed joint development of advanced-chip-to-wafer (AC2W) technology. The two companies will also conduct joint strategic marketing and sales activities to promote the co-operation.
Wednesday 13th October 2004
Chip manufacturer Philips, research institution RWTH Aachen and equipment supplier AIXTRON signed a collaboration agreement aiming at the joint development of large-area white organic light emitting diodes (OLED).
Wednesday 13th October 2004
The European Commission (EC) has decided to formally ask France, the Netherlands, Finland and Sweden for information on certain invitations to tender launched by authorities in those countries for the supply of computer equipment. The EC is concerned with tenders that require the procurement of Intel microprocessors or microprocessors using a specific clock rate.

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