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Tuesday 12th October 2004
Freescale Semiconductor, Motorola's semiconductor spin-off, and TSMC have signed an agreement to jointly develop a new generation of silicon-on-insulator (SOI) high-performance transistor front-end technology targeted for the 65nm CMOS process node. The three-year agreement also provides TSMC with manufacturing rights to Freescale's 90nm SOI technology.
Monday 11th October 2004
STMicroelectronics is to be the first global semiconductor manufacturer to become a partner in the Chinese Open Platform Initiative that is developing a computing platform based on Linux open-source software.
Monday 11th October 2004
Infineon Technologies and Finisar have agreed to reduce the number of shares needed for Finisar is to acquire Infineon's Fibre Optics business unit based in Berlin, Germany. The terms were modified in part due to the operating results for the business unit during the past six months.
Monday 11th October 2004
International Rectifier's Newport, Wales, facility has earned a UK energy efficiency award from the National Microelectronics Institute (NMI) trade group. The annual British Energy-NMI Energy Efficiency Award is bestowed on the semiconductor facility that has best shown environmental stewardship through significantly reducing energy consumption and gas emissions.
Monday 11th October 2004
STMicroelectronics is to be the first global semiconductor manufacturer to become a partner in the Chinese Open Platform Initiative that is developing a computing platform based on Linux open-source software.
Monday 11th October 2004
BOC Edwards has opened a new European pump remanufacturing facility at Crawley, UK.
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Monday 11th October 2004
IBM researchers have created room-temperature vanadium oxide (VnOx) nanotube ferromagnets (Nature, October 7, 2004).
Monday 11th October 2004
UK firm Jennic is repositioning its wireless connectivity business from an intellectual property (IP) approach to a fabless manufacturing business model, offering complete integrated circuits (IC) directly to its customer base.
Monday 11th October 2004
KLA-Tencor and IMEC have entered into a joint-development project (JDP) to accelerate the adoption of optical critical dimension (CD) metrology technology for next-generation (65nm and below) semiconductor applications.
Monday 11th October 2004
Oxford Instrument Plasma Technology (OIPT) has officially opened a new molecular beam epitaxy (MBE) production facility in East Grinstead, UK.
Monday 11th October 2004
Hynix Semiconductor has completed the sale of its non-memory semiconductor operations to Citigroup Venture Capital for KRW954.3bn ($831.2mn).
Monday 11th October 2004
Market researcher Gartner reports that world capital semiconductor equipment spending is "on pace" to grow 66% in 2004.
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Monday 11th October 2004
The Taiwan foundries report September 2004 sales - TWD23.174tr for TSMC and TWD11.864tr for UMC.
Monday 11th October 2004
BOC Edwards will supply fluorine gas to Hynix Semiconductor's 300mm semiconductor manufacturing facility in Ichon, South Korea.
Monday 11th October 2004
Soitec is claiming the industry's first germanium-free, strained silicon-on-insulator (SOI) solution for partially-depleted (PD) CMOS IC architectures.
Monday 11th October 2004
SemiSouth Laboratories is to develop and integrate silicon carbide (SiC) power transistors and control circuitry within a compact power module with funding from a $2.67mn Advanced Technology Program (ATP) award from the US National Institute of Standards and Technology (NIST).
Monday 11th October 2004
The European Commission (EC) has adopted a communication on moving to the deployment and operational phases of the European GALILEO satellite radionavigation system.
Monday 11th October 2004
Varian Semiconductor Equipment Associates (VSEA) has received a $22mn payment from Applied Materials.
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Monday 11th October 2004
November 16 is being claimed as the 100th birthday for electronics with British scientist John Ambrose Fleming's 1904 invention of the thermionic diode.
Friday 8th October 2004
BOC Edwards has opened a new European pump remanufacturing facility at Crawley, UK. The GBP1.2mn facility includes decontamination facilities, two flow-lines, a clean room and an award winning wastewater-recycling plant.
Friday 8th October 2004
Soitec is claiming the industry's first germanium-free, strained silicon-on-insulator (SOI) solution for partially-depleted (PD) CMOS IC architectures. The new PD-sSOI has a thick 40nm strained silicon layer that exhibits excellent thickness and strain uniformity across the entire wafer. Testing also verifies that this high-level strain can be maintained throughout the subsequent high-temperature processes used in the semiconductor manufacturing cycle.
Friday 8th October 2004
UK firm Jennic is repositioning its wireless connectivity business from an intellectual property (IP) approach to a fabless manufacturing business model, offering complete integrated circuits (IC) directly to its customer base.
Thursday 7th October 2004
IBM researchers have created room-temperature vanadium oxide (VnOx) nanotube ferromagnets (Nature, October 7, 2004). The multi-walled tubes are formed in a controllable self-assembly process.
Thursday 7th October 2004
KLA-Tencor and IMEC have entered into a joint-development project (JDP) to accelerate the adoption of optical critical dimension (CD) metrology technology for next-generation (65nm and below) semiconductor applications.

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